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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser,
- Viscosity: 20,000 to 30,000 cP
- Use Temperature: 635 F
- Coeff. of Thermal Expansion (CTE): 10.555555555555555 to 37.77777777777778 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.56
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Supplier: Abrisa Technologies
Description: Abrisa Technologies offers Asahi Glass Corporation (AGC) EN-A 1 material, a highly transmissive, alkali-free thin boro-aluminosilicate glass that is ideal for highly sensitive bio-photo detection applications, high throughput sensor applications and as enhancement glass
- Length: 25 inch
- Width / O.D.: 20 inch
- Thickness / Wall Thickness: 0.01181103 to 0.02755907 inch
- Density: 2.5099984158710837 g/cc
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Supplier: Aremco Products, Inc.
Description: Good adhesion to metals, low cte metals
- Max Use / Curie Temperature: 1,648.888888888889 C
- Coeff. of Thermal Expansion (CTE): 7,740,000 µm/m-C
- Material Type: Alumina / Aluminum Oxide
- Applications: Ceramics / Glass Manufacturing, Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Refractory / High Temperature Materials
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards. It features a high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), providing a
- Dielectric Strength: 533.4000000000011 kV/in
- Dielectric Constant (Relative Permittivity): 4.67
- Industry: Automotive, Electronics, Semiconductors / IC Packaging
- Features: Thermally Conductive
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Supplier: Robuster Quartz
Description: Robuster Quartz Fused Silica Ceramics features excellent thermal reliability under high temperature (up to 1350˚C), resistivity to chemical corrosion and thermal shock; Our Silica ceramic products are widely used in chemical, medical and biology industries for chemical
- Length: 2.362206 to 5.905515 inch
- Width / O.D.: 1.1023628 to 5.905515 inch
- Max Use Temperature: 1,200 C
- Applications: Chemical / Materials Processing
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), purposefully engineered for high-temperature automotive applications that require exceptional board-level
- Industry: Automotive, Electronics, Semiconductors / IC Packaging
- Chemical System: Epoxy (EP)
- Features: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: heat. Some other positives include low shrinkage upon curing, a low CTE and a high degree of dimensional stability. It bonds well to a wide variety of substrates including metals, composites, ceramics and most plastics.
- Use Temperature: -452 to 400 F
- Thermal Conductivity: 3.17 to 3.61 W/m-K
- Tensile Strength (Break): 6,000 to 7,000 psi
- Dielectric Constant (Relative Permittivity): 4.8
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Supplier: Henkel Corporation - Electronics
Description: Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube or mid-size container. Liqui-Bond SA 1800 features a combination of high thermal conductivity with a
- Features: Electrically Conductive, Thermally Conductive
- Industry: Electronics
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Supplier: Dymax
Description: OP-60 high-performance optical adhesive cures upon exposure to UV or visible light in seconds. OP-60 is a low-shrinkage, low-outgassing, low-CTE adhesive designed for the precise positioning of lenses, prisms, and other optical components. OP-60 bonds to metal, glass, ceramic,
- Viscosity: 150,000 cP
- Substrate Compatibility: Dissimilar Substrates
- Cure / Technology: UV / Radiation Cured (EB, Light)
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Supplier: Abrisa Technologies
Description: maintain unobscured viewing and optical sensing in cold climates. The coatings deliver the high uniformity and low scatter performance needed to preserve high resolution digital imaging, sensing or display outputs while maintaining high throughput efficiency and clarity. Our
- Features: Electric, Other
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Supplier: Robuster Quartz
Description: Robuster Quartz Fused Silica Ceramics features excellent thermal reliability under high temperature (up to 1350˚C), resistivity to chemical corrosion and thermal shock; Our Silica ceramic products are widely used in chemical, medical and biology industries for chemical
- Capacity: 0.6102381612381612 to 12.204763224763223 cubic inches
- O.D. / Width: 1.574804 to 4.4488213 inch
- Height: 0.7086618 to 1.8503947 inch
- Applications: Chemical Processing
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Supplier: Robuster Quartz
Description: Robuster Quartz Fused Silica Ceramics features excellent thermal reliability under high temperature (up to 1350˚C), resistivity to chemical corrosion and thermal shock; Our Silica ceramic products are widely used in chemical, medical and biology industries for chemical
- Capacity: 0.3051190806190806 to 9.153572418572418 cubic inches
- O.D. / Width: 1.1417329 to 3.3070884 inch
- Height: 1.1417329 to 2.2834658 inch
- Applications: Chemical Processing, Foundry / Casting
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Supplier: General Plastics Manufacturing Co.
Description: Tool and mold makers count on General Plastics for superior-quality LAST-A-FOAM® machinable foam, polyurethane molds, and pattern-to-tool capabilities. Our wide range of high-density foam formulations satisfies diverse manufacturing needs from low-temperature layup to high-temperature
- Industry Served: Aerospace, Marine, Medical
- Services: CAD/CAM Support, Design Assistance, Prototyping
- Features: Custom / Specialty Tools, North America, Northwest US Only, United States Only
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EP5LTE-100 has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance. EP5LTE-100 passes NASA (read more)
Browse Leveling and Filling Compounds Datasheets for Master Bond, Inc. -
the laminate supplier used. Thermal Stability: High-speed circuits generate significant heat. Materials with high glass transition (Tg), decomposition temperature (Td), and low coefficient of thermal expansion (CTE) prevent warpage and via stress. Boards should be qualified to IPC-6012 for (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
temperature, low CTE tooling board offers outstanding stability and versatility. Its higher glass transition temperature and low coefficient of thermal expansion (CTE) makes it suitable for use in vacuum-forming applications where other urethane products may soften or deform. (read more)
Browse Tool and Die Makers Datasheets for General Plastics Manufacturing Co. -
supplier used. Thermal Stability: High-speed circuits generate significant heat. Materials with high glass transition (Tg), decomposition temperature (Td), and low coefficient of thermal expansion (CTE) prevent warpage and via stress. Boards should be qualified to IPC-6012 for general digital (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect
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P‐197L: Late‐News Poster : Impacts of Glass Substrate and Frit Properties on Sealing for OLED Lighting
Even for high CTE glass substrates, the lower CTE frits produce more robust sealing.
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Calcium Zinc Borosilicate Glass with High Thermal Expansion Coefficient for LTCC Applications
existing works.6–10 As the developed high CTE glass is aimed to be applied as a dielectric material, the dielectric constant of the glass has been also estimated and compared with the predicted value based on Eq. (1) as reference data.
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P‐184L: Late‐News Poster : Transient Thermal Stress Modeling of the Laser Frit Sealing Process
The results explained why high CTE glass is hard to seal.
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Microporous and Thin Film Membranes for Solid Oxide Fuel
• Calcium-strontium alumino-pyrosilicate and calcium-zinc pyrosilicate phases are desirable crystalline phases which appear to stabilize the formation of higher CTE glass - ceramics in compositions like G#27 and G#42.
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Fabrication Methods for Precision Optics
Even glasses with much lower CTE should be treated with care when they are hot, but the high CTE glasses warrant extraordinary attention.
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Solder Joint Reliability Prediction for Multiple Environments
High CTE Glass .
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Couple: an integrated model for optical interconnect modules
It is clear that an alternative to this high CTE glass cover should be investigated.
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Thermo-Mechanical Reliability of High-End Flip Chip BGA Packages: Comparison Heat Spreader and Motherboard Construction
As a result, a new material to be used is the high CTE Glass ceramic to improve the solder join fatigue lifetime.
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Optical Design of Microscopes
The higher CTE glass may crack during rapid change in temperature.
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Electronic Materials and Processes Handbook, Third Edition > Ceramics and Glasses
Kyocera’s HITCE system, formulated with high CTE glass and crystalline filler having a combined CTE of 11.5ppm/°C, is well suited for applications wherein the ceramic is to be attached to a PWB with a CTE in the 12 to 16ppm/°C range.