QFN Contact Socket

Description: IC SOCKET, QFN, 80 POSITION, 0.5MM, THROUGH HOLE; No. of Contacts:80Contacts; Connector Type:QFN Test Socket; Pitch Spacing:0.5mm; Product Range:280 Series; Row Pitch:-; Contact Material:Beryllium Copper RoHS Compliant: Yes

Description: IC SOCKET, QFN, 56 POSITION, 0.4MM, THROUGH HOLE; No. of Contacts:56Contacts; Connector Type:QFN Test Socket; Pitch Spacing:0.4mm; Product Range:256 Series; Row Pitch:-; Contact Material:Beryllium Copper RoHS Compliant: Yes

Description: IC SOCKET, QFN, 60 POSITION, 0.4MM, THROUGH HOLE; No. of Contacts:60Contacts; Connector Type:QFN Test Socket; Pitch Spacing:0.4mm; Product Range:260 Series; Row Pitch:-; Contact Material:Beryllium Copper RoHS Compliant: Yes

Description: IC SOCKET, QFN, 48 POSITION, 0.5MM, THROUGH HOLE; No. of Contacts:48Contacts; Connector Type:QFN Test Socket; Pitch Spacing:0.5mm; Product Range:248 Series; Row Pitch:-; Contact Material:Beryllium Copper RoHS Compliant: Yes

Description: SILMAT® CONTACT TECHNOLOGY It is NOT a cheap conductive rubber sheet It is NOT a prototype or a copy It IS a cost effective, low profile contact structure engineered with specific materials and features to provide electrical and mechanical advantages for high performance applications

• Current Rating: 4 amps
• Operating Temperature: -55 to 200 C
• Contacts Pitch: 10.16 mm
• Socket Type: BGA, LGA, QFN, Test / Prototyping Socket

Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal contact for package e-pad Solutions

• Contact Resistance: 200 milliohms
• Operating Temperature: 150 C
• Contact Plating: Gold Plating
• Product Type: IC Socket

Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations confirm application Positive locking lid High

• Product Type: IC Socket

Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid

• Product Type: IC Socket

Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in).

• Operating Temperature: -67 to 392 C
• Contacts Pitch: 2.54 mm
• Socket Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket
• Features: Clamshell Socket, Other

Description: Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locater plate Pointed top interface to DUT pad Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded

• Contact Resistance: 349.99999999999994 milliohms
• Operating Temperature: 125 C
• Contact Plating: Gold Plating
• Product Type: IC Socket

Description: SOCKET BODY MATERIAL: specified at time of quotation INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side AVAILABLE PITCHES: down to 0.32mm CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP). VSWR <2:1 to 40GHz CONTACT RESISTANCE: <20mΩ CONTACT

• Current Rating: 4 amps
• Contact Resistance: 20 milliohms
• Operating Temperature: -40 to 65.55555555555556 C
• Contacts Pitch: 0.32 mm

Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ●Highly reliable M-pin Probes as contact parts ●High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10

• Voltage Rating: 100 volts
• Current Rating: 1 amps
• Contact Resistance: 100 milliohms
• Operating Temperature: -40 to 150 C

Description: while being operator-friendly Kelvin Test Socket Contact System is available for any Aries CSP and Center Probe Test Sockets Pressure pad compression spring provides proper force against device and allows for height variations in device thickness Probe blade edge tip for cutting

• Operating Temperature: -55 to 150 C
• Contacts Pitch: 0.4 to 0.45 mm
• Features: Clamshell Socket, Other, Solderless
• Contact Plating: Gold Plating, Nickel Plating

Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature test. Contactor types include

• Number of Contacts: 1,521
• Contacts Pitch: 1 mm
• Socket Type: BGA
• Contact Plating: Gold Plating

Description: bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low configuration to protect spring probes during use Benefits Tested to 500K Short contact path for excellent DC

• Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
• Product Type: IC Socket

Description: Deserializer 1 Input 1 Output 64-QFN (9x9) Contact Finish: Tin Contact Finish Thickness: 5.90µin (0.150µm)

Description: Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs)>Linear>Amplifiers>Video Amps and Modules Package: 23-PowerQFN Product Status: Obsolete Contact Type: Female Socket Style: C Number of Positions: 5 Number of Positions Loaded: All Row