Help with IC Package Converters and Adapters specifications:
Product Type
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| Product Type | |||
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| Package Adapters / Converters | IC Package Converters or Adapters are electronic interconnect devices used to convert from one type of IC socket or package to another. They provide an electrical and mechanical conversion from one type of package to another. | ||
| IC Probing / Analysis Adapters | Sockets or adapters used for measuring and testing circuit boards. | ||
| Programming Adapters | Programming adapters are designed to convert the pin-out of one integrated circuit (IC) package into another. They provide a socket for various IC package types and plug into a device programmer or prototype board. | ||
| Prototyping Adapters | Adapters used for prototyping circuits. | ||
| Other | Other unlisted interconnect types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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RoHS Compliant
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| RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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Package Adapters / Converters Specifications
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| Top (Input) Side Package | |||
| Your choices are... | |||
| BGA | Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. | ||
| DIP | Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. | ||
| SIP | Single in-line package (SIP). | ||
| LGA | Land-grid array (LGA). | ||
| PGA | Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. | ||
| IPGA | Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA. | ||
| QFN | Quad flat non-leaded package (QFN). Also known as QFNL. | ||
| QFP | Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications. | ||
| PLCC | Plastic leaded chip carrier (PLCC). | ||
| SOIC / SOP | Small outline integrated circuit (SOIC). | ||
| TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
| VSSOP | Very thin shrink small outline package (VSSOP). | ||
| ZIP / SZIP | Shrink zigzag in-line package (SZIP). | ||
| Other | Other unlisted or proprietary socket types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Output (Bottom) Side Package | |||
| Your choices are... | |||
| BGA | Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. | ||
| DIP | Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. | ||
| SIP | Single in-line package (SIP). | ||
| LGA | Land-grid array (LGA). | ||
| PGA | Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. | ||
| IPGA | Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA. | ||
| QFN | Quad flat non-leaded package (QFN). Also known as QFNL. | ||
| QFP | Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications. | ||
| PLCC | Plastic leaded chip carrier (PLCC). | ||
| SOIC / SOP | Small outline integrated circuit (SOIC). | ||
| TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
| VSSOP | Very thin shrink small outline package (VSSOP). | ||
| ZIP / SZIP | Shrink zigzag in-line package (SZIP). | ||
| Other | Other unlisted or proprietary socket types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Features and Standards
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| Features | |||
| Your choices are... | |||
| Solderless | These sockets can be mounted by compression. | ||
| ZIF Lock | Zero Insertion Force (ZIP) general sockets are a type of sockets for plugging in chips, such as the CPU. Unlike other types of chip sockets that must be forced into place, ZIF socket allow for manual installation via a cinching lever. | ||
| Knob Lock | The package is locked with a knob. | ||
| Screw Lock | The package is locked with a screw. | ||
| Machined Pins | The pins of the package are machined for better contact. Machining is a manufacturing process whereby a rapidly turning solid metal rod is cut to precise tolerances. | ||
| Open Top Socket | The socket does not have a cover. | ||
| Auto-eject Socket | The socket has a mechanism for auto-ejection. | ||
| Clamshell Socket | The socket has a cover that can be opened and closed. It is also known as a flip-top socket. | ||
| End Stackable | The ability for sockets to be mounted end-to-end while maintaining grid or spacing. | ||
| Other | Other unlisted or proprietary styles. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Military Standards | |||
| Your choices are... | |||
| MIL-STD-105 | Military standards for sample procedures and tables for inspection. | ||
| MIL-STD-109 | Military standards for quality assurance terms and definitions. | ||
| MIL-STD-202E | Military standards for quality standards for electronics parts. | ||
| MIL-ST-1130B | Military standards for connections. | ||
| MIL-STD-1344A | Military standards for testing electrical connectors. | ||
| MIL-STD-45662 | Military standards for calibration requirements. | ||
| MIL-C-39024 | Military standards for general specifications for connectors and interconnect devices. | ||
| MIL-C-39029 | Military standards for contacts and electrical connectors. | ||
| MIL-S-83505 | Military standards for general specifications for sockets. | ||
| MIL-S-83734 | Military standards for general specifications for DIP sockets. | ||
| MIL-T-55155 | Military standards for general specifications for solder terminals. | ||
| Other | Other unlisted Military Standards. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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