TSSOP IC Package Converters and Adapters

Fine Pitch Bump Adapters
from Aries Electronics, Inc.

FEATURES. Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm. Features raised connection pads up to 0.010 [0.25]. Available in tape-and-reel for high-speed surface-mount technology (SMT) assembly. Can be manufactured for RoHS compliance. GENERAL SPECIFICATIONS. BOARD... [See More]

  • Top (Input) Side Package: QFP; TSSOP; Fine Pitch Footprints
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Output (Bottom) Side Package: QFP; TSSOP; Fine Pitch Footprints
Low-Cost, Quick Turn Small Outline Prototyping Adapter
from Aries Electronics, Inc.

FEATURES. Mates SOT23, SOIC, MSOP, or TSSOP packages to standard breadboard and breakout boards for rapid and easy prototyping. Panelized adapters available upon request. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces. PIN INSULATOR: Polyester, UL... [See More]

  • Top (Input) Side Package: SOIC; TSSOP; SOT23, MSOP
  • Output (Bottom) Side Package: Standard Breadboard and Breakout Boards
  • Product Type: Prototyping Adapters