PGA IC Package Converters and Adapters

PLCC Adapters with Murphy Circuits®
from Advanced Interconnections Corp.

Adapters for Jedec .050" (1.27mm) Pitch PLCC's (Leaded Type A) feature our own patented Murphy Circuits ®. [See More]

  • Output (Bottom) Side Package: PGA
  • Top (Input) Side Package: PLCC
  • Product Type: Package Adapters / Converters
  • Military Standards: MIL-P-81728
132-Pin Amp PQFP-to-PGA Footprint Socket
from Aries Electronics, Inc.

FEATURES. Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical... [See More]

  • Output (Bottom) Side Package: PGA
  • Top (Input) Side Package: PQFP
  • Product Type: Package Adapters / Converters
144-Pin QFP-to-PGA Adapter for Motorola 68340
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Output (Bottom) Side Package: PGA
  • Top (Input) Side Package: QFP
  • Product Type: Package Adapters / Converters
144-Pin VQFP-to-PGA Adapter
from Aries Electronics, Inc.

FEATURES. Convert surface-mount VQFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Output (Bottom) Side Package: PGA
  • Top (Input) Side Package: VQFP
  • Product Type: Package Adapters / Converters
PLCC-to-PGA Adapter
from Aries Electronics, Inc.

FEATURES. Convert surface-mount PLCC packages to a PGA footprint. Pin polarization option also available. For Panelized Form or for mounting of consigned chips, consult factory. GENERAL SPECIFICATIONS. ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces. PADS: hot-air solder leveled. [See More]

  • Output (Bottom) Side Package: PGA
  • Top (Input) Side Package: PLCC
  • Product Type: Package Adapters / Converters
QFP-to-PGA Adapter for 160-Position, 0.0256" [0.65mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Output (Bottom) Side Package: PGA
  • Top (Input) Side Package: QFP
  • Product Type: Package Adapters / Converters