QFP IC Package Converters and Adapters

144-Pin QFP-to-PGA Adapter for Motorola 68340
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: PGA
  • Product Type: Package Adapters / Converters
44-Pin 0.8mm QFP-to-44-Pin PLCC Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to QFP without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: PLCC
  • Product Type: Package Adapters / Converters
48-Pin 0.5mm QFP-to-48-Pin 0.600" DIP Adapter
from Aries Electronics, Inc.

EATURES. Makes 48-pin QFP prototype circuits with a standard breadboard easy. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASASTM B579-73 over... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters
Fine Pitch Bump Adapters
from Aries Electronics, Inc.

FEATURES. Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm. Features raised connection pads up to 0.010 [0.25]. Available in tape-and-reel for high-speed surface-mount technology (SMT) assembly. Can be manufactured for RoHS compliance. GENERAL SPECIFICATIONS. BOARD... [See More]

  • Top (Input) Side Package: QFP; TSSOP; Fine Pitch Footprints
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Output (Bottom) Side Package: QFP; TSSOP; Fine Pitch Footprints
Low-Cost, Quick Turn QFP Prototyping Adapter
from Aries Electronics, Inc.

FEATURES. Mates common QFP packages to standard breadboard and breakout boards for rapid. and easy prototyping. Panelized adapters available upon request. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces. PIN INSULATOR: Polyester, UL 94V-0. PINS: 360... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: Standard Breadboard and Breakout Boards
  • Product Type: Prototyping Adapters
QFP-to-PGA Adapter for 160-Position, 0.0256" [0.65mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: PGA
  • Product Type: Package Adapters / Converters
QFP-to-PGA Adapter for JEDEC 132-Position, 0.025" [0.64mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: PGA
  • Product Type: Package Adapters / Converters
QFP-to-PGA Adapter for Motorola DSP56000/001
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: PGA
  • Product Type: Package Adapters / Converters
QFP-to-PGA Adapter for SOIC (EIAJ) 208-Position, 0.0197" [0.50mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 17x17 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Top (Input) Side Package: QFP
  • Output (Bottom) Side Package: PGA
  • Product Type: Package Adapters / Converters