SOIC / SOP IC Package Converters and Adapters

SOIC Adapter Series
from Advanced Interconnections Corp.

Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC Devices (SOIC to DIP). RoHS Compliant designs and mating DIP Sockets are available. [See More]

  • Top (Input) Side Package: SOIC
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Package Adapters / Converters
  • Output (Bottom) Side Package: SOIC
24-Pin SOIC-to-22-Pin 0.400" DIP
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]

  • Top (Input) Side Package: SOIC
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters
Adapter for Motorola MC145158-2 SOIC D to 20-Pin PLCC
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per... [See More]

  • Top (Input) Side Package: SOIC; SOIC D
  • Output (Bottom) Side Package: PLCC
  • Product Type: Package Adapters / Converters
Low-Cost, Quick Turn Small Outline Prototyping Adapter
from Aries Electronics, Inc.

FEATURES. Mates SOT23, SOIC, MSOP, or TSSOP packages to standard breadboard and breakout boards for rapid and easy prototyping. Panelized adapters available upon request. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces. PIN INSULATOR: Polyester, UL... [See More]

  • Top (Input) Side Package: SOIC; TSSOP; SOT23, MSOP
  • Output (Bottom) Side Package: Standard Breadboard and Breakout Boards
  • Product Type: Prototyping Adapters
Series 350000 SOIC & SOJ-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu... [See More]

  • Top (Input) Side Package: SOIC; SOJ
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters
Series 350000-11-RC Lead-Free RoHS/WEEE-Compliant SOIC-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with... [See More]

  • Top (Input) Side Package: SOIC
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Output (Bottom) Side Package: DIP
Series 350000-HT High-Temperature SOIC-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick Polyimide, Tg 260 °C with 1-oz. [See More]

  • Top (Input) Side Package: SOIC
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters