PLCC IC Package Converters and Adapters

PLCC Adapters with Murphy Circuits®
from Advanced Interconnections Corp.

Adapters for Jedec .050" (1.27mm) Pitch PLCC's (Leaded Type A) feature our own patented Murphy Circuits ®. [See More]

  • Top (Input) Side Package: PLCC
  • Output (Bottom) Side Package: PGA
  • Product Type: Package Adapters / Converters
  • Military Standards: MIL-P-81728
52-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP
from Aries Electronics, Inc.

FEATURES. Allows placing an PLCC package on a board laid out for a shrink DIP. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides. PADS: HASL. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100... [See More]

  • Top (Input) Side Package: PLCC
  • Output (Bottom) Side Package: DIP; SDIP
  • Product Type: Package Adapters / Converters
68-Pin PLCC Motorola MC68HC000-to-64-Pin DIP
from Aries Electronics, Inc.

FEATURES. Allows easy replacement of a difficult-to-find part. GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. MALE PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM B579-73 over 100 µ [2.54 µ]... [See More]

  • Top (Input) Side Package: PLCC
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Converter – RoHS-Compliant
from Aries Electronics, Inc.

FEATURES. Lead-free RoHS/WEEE-compliant. A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides. PADS: finished with ENIG (Immersion... [See More]

  • Top (Input) Side Package: PLCC
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters
  • Military Standards: MIL-G-45204
PLCC-to-16-Pin DIP Adapter for Motorola MC12009 & Other Microprocessors
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to PLCC package without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 ASTM... [See More]

  • Top (Input) Side Package: PLCC
  • Output (Bottom) Side Package: DIP
  • Product Type: Package Adapters / Converters
PLCC-to-DIP Adapter – RoHS/WEEE-Compliant
from Aries Electronics, Inc.

FEATURES. Converts PLCC packaged ICs-to-DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC Sockets or PLCC Pads on top side. For Panelized Form or for mounting of consigned ICs, consult factory. GENERAL SPECIFICATIONS. ADAPTER BODY: 0.062 [1.58] FR-4 or IS410 per IPC... [See More]

  • Top (Input) Side Package: PLCC
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Output (Bottom) Side Package: DIP