DIP IC Package Converters and Adapters

DIP Adapter Series
from Advanced Interconnections Corp.

Our high quality, dependable DIP Sockets and Adapters accommodate applications from surface mount to thru-hole. Screw-machined terminals offer superior quality for long-term durability. [See More]

  • Output (Bottom) Side Package: DIP
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Package Adapters / Converters
  • Top (Input) Side Package: DIP
0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: MSOP
  • Product Type: Package Adapters / Converters
24-Pin SOIC-to-22-Pin 0.400" DIP
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: SOIC
  • Product Type: Package Adapters / Converters
24-Pin SOWIC-to-0.400" CTR DIP Adapter for 75ALS162 & Others
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. RoHS Compliant Board FR406 or IS410 per IPC 4101A/46. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN... [See More]

  • Output (Bottom) Side Package: DIP
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Package Adapters / Converters
  • Top (Input) Side Package: SOWIC
36-Pin SSOP-to-0.600" DIP Adapter
from Aries Electronics, Inc.

GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. PADS: bare Cu protected with Entek ® by Enthone or Omikron ® white Sn to eliminate co-planarity concerns and solder bridges. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. OPERATING TEMPERATURE: 221 °F... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: SSOP
  • Product Type: Package Adapters / Converters
48-Pin 0.5mm QFP-to-48-Pin 0.600" DIP Adapter
from Aries Electronics, Inc.

EATURES. Makes 48-pin QFP prototype circuits with a standard breadboard easy. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASASTM B579-73 over... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: QFP
  • Product Type: Package Adapters / Converters
68-Pin PLCC Motorola MC68HC000-to-64-Pin DIP
from Aries Electronics, Inc.

FEATURES. Allows easy replacement of a difficult-to-find part. GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. MALE PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM B579-73 over 100 µ [2.54 µ]... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: PLCC
  • Product Type: Package Adapters / Converters
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Converter – RoHS-Compliant
from Aries Electronics, Inc.

FEATURES. Lead-free RoHS/WEEE-compliant. A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides. PADS: finished with ENIG (Immersion... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: PLCC
  • Product Type: Package Adapters / Converters
  • Military Standards: MIL-G-45204
PLCC-to-16-Pin DIP Adapter for Motorola MC12009 & Other Microprocessors
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to PLCC package without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 ASTM... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: PLCC
  • Product Type: Package Adapters / Converters
PLCC-to-DIP Adapter – RoHS/WEEE-Compliant
from Aries Electronics, Inc.

FEATURES. Converts PLCC packaged ICs-to-DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC Sockets or PLCC Pads on top side. For Panelized Form or for mounting of consigned ICs, consult factory. GENERAL SPECIFICATIONS. ADAPTER BODY: 0.062 [1.58] FR-4 or IS410 per IPC... [See More]

  • Output (Bottom) Side Package: DIP
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Top (Input) Side Package: PLCC
PLCC-to-DIP Adapter for Intel 80/83C652 and 80C251 Microprocessors
from Aries Electronics, Inc.

Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter – P/N 1109342. FEATURES. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. Allows user to switch package styles and avoid shortage problems. Designed to plug directly... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: PLCC
  • Product Type: Package Adapters / Converters
Row-to-Row DIP Adapter Socket
from Aries Electronics, Inc.

FEATURES. Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600 [15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24] or 0.300 [7.62] center devices in the same application. GENERAL SPECIFICATIONS. SOCKET BODY: black UL 94V-0... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: DIP
  • Product Type: Package Adapters / Converters
  • Military Standards: MIL-G-45204
Series 350000 SOIC & SOJ-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu... [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: SOIC; SOJ
  • Product Type: Package Adapters / Converters
Series 350000-11-RC Lead-Free RoHS/WEEE-Compliant SOIC-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with... [See More]

  • Output (Bottom) Side Package: DIP
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Top (Input) Side Package: SOIC
Series 350000-HT High-Temperature SOIC-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick Polyimide, Tg 260 °C with 1-oz. [See More]

  • Output (Bottom) Side Package: DIP
  • Top (Input) Side Package: SOIC
  • Product Type: Package Adapters / Converters