Solderless IC Package Converters and Adapters

CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Features: Solderless
  • Military Standards: MIL-G-45204
  • Product Type: IC Probing / Analysis Adapters
BGA (ZIF Sockets) Prototyping Adaptor -- PA-BGA-PENTIUM-01
from Ironwood Electronics, Inc.

These adapters provide ZIF sockets for the BGA device. Several styles of ZIF sockets are employed, includng "Clam Shell", "Open Top", and "Open Top with Lever". All of the ZIF sockets employ gold contacts and are capable of 10,000 insertion cycles. [See More]

  • Features: Solderless; ZIF Lock; Open-Top
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Prototyping Adapters
High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
from Aries Electronics, Inc.

High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]

  • Features: Solderless; Clamshell Socket
  • Military Standards: MIL-G-45204
  • Product Type: IC Probing / Analysis Adapters
Device Under Test Prototyping Adaptor -- DT-QFE80SC-P-Z-01
from Ironwood Electronics, Inc.

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  • Features: Solderless; ZIF Lock; Open-Top
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Prototyping Adapters
High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]

  • Features: Solderless; Clamshell Socket
  • Military Standards: MIL-G-45204
  • Product Type: IC Probing / Analysis Adapters
DIP Socket Probing Adaptor -- SP-DIP64-03-Z
from Ironwood Electronics, Inc.

Our socket probing adapters for DIP packages reliably connect test equipment to in-circuit devices. Gold plated test points are typically 0.025" square, standard 0.1" headers. The headers are arranged in dual rows to one side or single row on either side of the DIP package. [See More]

  • Features: Solderless; ZIF Lock
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters
High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]

  • Features: Solderless; Clamshell Socket
  • Military Standards: MIL-G-45204
  • Product Type: IC Probing / Analysis Adapters
PLCC IC Clip -- CL-PLCC84-S-01
from Ironwood Electronics, Inc.

Our two piece PLCC Carrier Adapters incorporate pluggable bases that are available in solderable J-lead, PLCC plug, or clip-on versions. ZIF or production sockets are used to house the PLCC device on the upper probe board assembly. These adapters may be ordered without test points. [See More]

  • Features: Solderless
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters
High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Features: Solderless; Clamshell Socket
  • Military Standards: MIL-G-45204
  • Product Type: IC Probing / Analysis Adapters
PLCC Lo Clip -- LC-PLCC20-01
from Ironwood Electronics, Inc.

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  • Features: Solderless
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters
Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages
from Aries Electronics, Inc.

FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]

  • Features: Solderless; Clamshell Socket (optional feature)
  • Military Standards: MIL-G-45204
  • Product Type: IC Probing / Analysis Adapters
PLCC Probing Adaptor -- CA-PLCC20-Z-C-T-01
from Ironwood Electronics, Inc.

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  • Features: Solderless; ZIF Lock; Open-Top
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters
QFL Probing Adaptor -- CA-QFE144S-M-S-01
from Ironwood Electronics, Inc.

The IC device is soldered directly to surface mount lands on the upper assembly. These are the least expensive, yet most electrically stable, of our QFP probing adapter upper assemblies. In some cases, the option of square or rectangular pads is offered. [See More]

  • Features: Solderless; ZIF Lock; Clamshell Socket
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters
QFL Probing Adaptor -- CA-QFE32SA-L-Z-T-02
from Ironwood Electronics, Inc.

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  • Features: Solderless; ZIF Lock; Clamshell Socket
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters
QFN/MLF ZIF Prototype Adaptor -- PA-MLF8A-P-Z-01
from Ironwood Electronics, Inc.

We offer prototyping adapters for QFN from 8 to 100 pins and body sizes from 2X3mm to 12X12mm. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated pins and short traces insure integrity in mechanical and electrical connections. [See More]

  • Features: Solderless; ZIF Lock
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Prototyping Adapters
QFP (ZIF Socket) Prototyping Adaptor -- PA-QFP-A14100A-P-Z-01
from Ironwood Electronics, Inc.

We offer over 300 prototyping adapters for QFP devices that incorporate ZIF sockets. Many prototyping panel and QFP package combinations are available, so be sure to check the panel and package information. [See More]

  • Features: Solderless; ZIF Lock
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: Prototyping Adapters
SOIC Probing Adaptor -- CA-SO28U-Z-M-T-01
from Ironwood Electronics, Inc.

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  • Features: Solderless; ZIF Lock; Open-Top
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Probing / Analysis Adapters