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Supplier: TE Connectivity
Description: Plating Material Thickness : .38 MICM [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM [120 MICIN ] Socket Style : DIMM Dimensions
- Voltage Rating: 1.1 volts
- Current Rating: 1.5 amps
- Operating Temperature: -55 to 105 C
- Number of Contacts: 288
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Supplier: TE Connectivity
Description: Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Application Circuit Application : Signal Packaging Features Packaging Method : Tape & Reel Packaging Quantity : 200 Product Type
- Voltage Rating: 3.3 volts
- Operating Temperature: -55 to 105 C
- Number of Contacts: 144
- Contacts Pitch: 0.8 mm
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Supplier: InnoDisk USA Corporation
Description: Programmable Sequential / Interleave Burst Mode Average Refresh Period 7.8us FBGA Pb-Free package All of Lead-free products are compliant for RoHS PCB Dimension DIMM 18.24mm / SO-DIMM 25.54mm Storage Temperature -55C~ -+100C Operating Temperature -40C~ + 85C
- Capacity: 256 to 2,000 MB
- Clock Speed: 533 to 667 MHz
- Pin Count: 200 to 240 #
- Operating Temperature: -40 to 185 F
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: DDR4 SODIMM 260P 8.0H RVS DRAM Type:Small Outline (SO);Stack Height:8 mm;Stack Height:.315 in;Module Orientation:Right Angle;PCB Mounting Style:Surface Mount Small Outline (SO) 8 mm .315" Right Angle | So Dimm | Part# 2309412-1 | TE Connectivity Product overview: 2309412-1 from TE
- Memory Category: DRAM
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Supplier: Acromag, Inc.
Description: for industrial and defense applications, the XCOM-6400 has an extra rigid PCB and extended temperature support. The 4th generation of Intel’s i5 and i7 processors delivers many enhanced capabilities for media, graphics, security, and power management. Huge performance improvements were made
- Capacity: 4,000 to 16,000 MB
- Operating Temperature: -4 to 158 F
- Operating Humidity: 90 %
- Form Factor: COM Express Basic
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SO-DIMM DDR5 262 positions PCB mount connectors/ Non-downward compatibility to DDR4. Features & Benefits - 3 mounting type as options in right angle top mount, right angle reverse and vertical mounted, available in heights at 4.0, 5 (read more)
Browse Edge Connectors Datasheets for Rego Electronics Inc.
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http://www.iosrjournals.org/iosr-jece/papers/Vol6-Issue5/A0650111.pdf
SODIMMs are smaller and thinner than regular DIMMs, and the 204-pin SODIMM PCBs are always ~2.6 inches long and are usually around 1.18 inches high (though the heights can vary slightly).
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Dynamic study and structure enhancement of small outline dual-in-line memory module
This study proposes the structural enhancement of the SODIMM module PCB clip using FEA.
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The Nintendo 3DS games console [The Teardown]
… 4 Intel, BD82HM55SLGZS, platform controller hub 5 Ene Technology, KB926QF, keyboard controller 6 Broadcom, BCM57780A1KMLG, Ethernet controller 7 Texas Instruments, SN75DP139RGZ, translator 8 Realtek, ALC272X-GR, audio codec 9 Optical driver connect printed circuit board ( PCB ) 10 SODIMM memory module PCB 11WLAN …
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The teardown
… 4 Intel, BD82HM55SLGZS, platform controller hub 5 Ene Technology, KB926QF, keyboard controller 6 Broadcom, BCM57780A1KMLG, Ethernet controller 7 Texas Instruments, SN75DP139RGZ, translator 8 Realtek, ALC272X-GR, audio codec 9 Optical driver connect printed circuit board ( PCB ) 10 SODIMM memory module PCB 11WLAN …
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DSPACE hardware architecture for on-board real-time image/video processing in European space missions
The printed circuit board ( PCB ) of the demonstrator has Compact-PCI 3U size and includes a DDR2 SODIMM connector with 2Gbyte of onboard memory.
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Development and evaluation of a high performance fine pitch SODIMM socket package
Since the overall SODIMM reliability is determined by both the memory module to socket interconnect reliability and socket leads to PCB interconnect reliability.
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DRAM Module Market Tracker - Q4 2013
While the PCB and packaged DRAM die only measure a few millimeters, the connectors are the real culprit for the added height requirement SODIMMs need.
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IOTA: the array controller for a gigapixel OTCCD camera for Pan-STARRS
The DAQ3U prototype design resulted in a 16 layer controlled impedance PCB with the following functionality: o Xilinx Virtex2pro V2P7, 672 ball BGA FPGA … … hardcore o LINUX OS o 100BT Ethernet communications interface o DDR SDRAM SODIMM o SSTL2 100MHz interface …
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http://mouser.com/catalog/specsheets/ARM9DIMM-LPC3250%20Mouser%20Brochure%20Rev1p4.pdf
• ARM9DIMM – CPU Module o Based on SODIMM form factor (Dual Inline Memory Module) o LPC3250 266MHz ARM926EJ-S core o Vector … … of External Secure EEPROM o 10/100 Ethernet PHY o Mini-JTAG Debug Connector o PCB Dimensions 2.66” x …
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Express-IBR
… and QM77 Chipset Features – Quad/dual core 3rd Generation Intel® Core Processor with Mobile Intel® QM77 Express Chipset – Up to 16GB ECC 1600MHz DDR3 memory in two SODIMM sockets – Three Digital … … 0 – 50% Thicker PCB for high vibration environments .