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Supplier: ASTM International
Description: 1.1 This test method covers the laboratory determination of the linear (one-dimensional) coefficient of thermal expansion of rock using bonded electric resistance strain gages. 1.2 This test method is applicable for unconfined pressure conditions over the
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Supplier: ASTM International
Description: 1.1 This test method covers the laboratory determination of the linear (one-dimensional) coefficient of thermal expansion of rock using bonded electric resistance strain gauges. 1.2 This test method is applicable for unconfined pressure conditions over the
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Supplier: ASTM International
Description: shall not be used for measurements on materials having a very low coefficient of expansion (less than 1 x 10 6 1°C). For materials having very low coefficient of expansion, interferometer or capacitance techniques are recommended. 1.2 The thermal
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Supplier: ASTM International
Description: 1.1 This test method covers determination of the coefficient of linear thermal expansion for plastic materials having coefficients of expansion greater than 1 µm/(m.°C) by use of a vitreous silica dilatometer. At the test temperatures and under
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Supplier: Adhesives.org
Description: bonding process. The normal variation of temperature and moisture in the service environment causes the adherends and the adhesive to swell and shrink. The adherends and adhesive are likely to have different thermal and moisture coefficients of expansion.
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Supplier: Henkel Corporation - Electronics
Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and
- Viscosity: 360,500 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Kuriyama of America, Inc.
Description: Assures the user that they are using a WASTEC designated Piranha® Hose Product. Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 0.25 inch
- Outside Diameter: 0.5 inch
- Working Pressure: 4,000 psi
- Temperature Range: 190 F
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Supplier: Kuriyama of America, Inc.
Description: Assures the user that they are using a WASTEC designated Piranha® Hose Product. Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 0.5 inch
- Outside Diameter: 0.83 inch
- Working Pressure: 3,000 psi
- Temperature Range: 190 F
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Supplier: Kuriyama of America, Inc.
Description: the user that they are using a WASTEC designated Piranha® Hose Product. Polyolefin or Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 1 inch
- Outside Diameter: 1.46 inch
- Working Pressure: 2,500 psi
- Temperature Range: 150 F
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Supplier: Kuriyama of America, Inc.
Description: - Assures the user that they are using a WASTEC designated Piranha® Hose Product. Seamless Thermoplastic Tube - Provides maximum resistance to hydrolysis. High Tensile One or Two Synthetic Fiber Braids - Contributes to low volumetric expansion and eliminates loss of strength from
- Inside Diameter: 0.1875 inch
- Outside Diameter: 0.41 inch
- Working Pressure: 4,000 psi
- Temperature Range: 160 F
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Supplier: Piranha Hose Products, Inc.
Description: volumetric expansion and eliminates loss of strength from moisture absorption. Abrasion Resistant Polyether-Urethane - Polyurethane cover provides exceptional cut, abrasion and fungus resistance. Slither® Cover - Cover is ultra slippery; allows hose to maneuver around and
- Inside Diameter: 0.25 inch
- Product Form: Complete Hose Assembly
- Features: Reinforced
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Supplier: Piranha Hose Products, Inc.
Description: volumetric expansion and eliminates loss of strength from moisture absorption. Abrasion Resistant Polyether-Urethane - Polyurethane cover provides exceptional cut, abrasion and fungus resistance. Slither® Cover - Cover is ultra slippery; allows hose to maneuver around and
- Inside Diameter: 0.5 inch
- Product Form: Complete Hose Assembly
- Features: Reinforced
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The Sporlan Type See-All moisture liquid indicator combines two functions of moisture and liquid indication into a single economical product. The indicator is a porous filter paper that is sensitive to moisture. A green dark color indicates the refrigerant is dry. A yellow color indicates (read more)
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speed data in environments where there is high vibration, moisture, salt, dirt and debris. It can also be used for off-road vehicles, ruggedized factory automation and robotics signal applications. The Max-M12 family of connectors is based on IEC 61076-2-101 and SAE J2839. They are backward (read more)
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coefficient of resistance (TCR) ensures minimal expansion under heat, maintaining consistent resistance and long-term stability. Isabellenhütte is experienced in developing high-reliability current-sense resistors for mission (read more)
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has small thermal expansion coefficient, good sand mold stability, no cracking, and reduces Casting defect such as veins caused by sand expansion. has a particle size close to spherical, a smooth surface, and a dense structure, which enables the binder to evenly cover, has (read more)
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fluctuations. A key advantage lies in our ability to mitigate CTE (coefficient of thermal expansion) mismatch, a leading cause of seal failure. By allowing the conductor, epoxy, and housing to expand and contract together, our process reduces mechanical stress, prevents cracking, and (read more)
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: Thermal Expansion Mismatch: Choosing materials with compatible coefficients of thermal expansion (CTE) prevents cracking or delamination during temperature changes. Chemical Incompatibility: Avoiding materials that react with each other (e (read more)
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Materials In the Materials Industry, dimensional measurement can yield much knowledge of the properties of materials including wear characteristics, compressibility, and coefficient of thermal expansion. Customers such as ASML, Corning (read more)
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excimer laser systems). UV laser processing (e.g. 355 nm UV laser cutting). Infrared optics (e.g. 1550 nm fiber optic communication). (2) High thermal stability Extremely low coefficient of thermal expansion (near zero expansion), suitable for: High and low temperature (read more)
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circuit interference, and its thermal expansion coefficient matches well with semiconductor materials; in terms of chemistry, it has high chemical stability and excellent oxidation resistance and can remain stable in corrosive environments such as acids and alkalis and high-temperature oxidizing (read more)
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More Information Top
Indicates content that may require registration and/or purchase.
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State-of-the-art CME measurement
Two coefficient of moisture expansion test methods have historically been used.
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Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy
Coefficient of thermal expansion is tested by using DMA Q800 and coefficient of moisture expansion is tested by using DMA Q800 jointed with a humidity generator.
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Evaluation of high-modulus pitch/cyanate material systems for dimensionally stable structures
4.1.5 CoeffIcient of moisture expansion (CME) testing .
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New low-cost dimensionally stable composite linear absolute position encoder scale
A long-term coefficient of moisture expansion (CME) test is currently being run on six 2.6 mm thick unidirectional samples, but the results won't be due until mid-July 1990.
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Gossamer Spacecraft: Membrane And Inflatable Structures Technology For Space Applications > Selected Properties Of Various Membrane Materials
Kapton HN Polyimide (1 mil) UPILEX-25S Polyimide UPILEXVT Heat bondable polyimide (1.2 mil) IMIDEX Polyimide CP1 Polyimide CP2 Polyimide Glass transition temperature, °C Test method Melt temperature, °C Test method Thermal coefficient of linear expansion Test method Moisture absorption, .
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Design considerations for composite materials used in the Mars Observer Camera
The results of this somewhat crude test indicated a coefficient of moisture expansion (CME) of .
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Concrete material characterization reinforced concrete tank structure Multi-Function Waste Tank Facility
Thermal Expansion Coefficient Effect of Moisture Concrete tested dry exhibits 20 to 40% higher compressive strength than concrete tested wet.
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Influence of Viscoelastic Behavior on Curl of Paper
The 100 g/m2 sheets were used for stress relaxation experiments, tension tests to obtain the short-term tension moduli, and tests to determine the moisture expansion coefficients in MD and CD.
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Journal of Composites Technology & Research Index to Volume 14 1992
Coefficient of moisture expansion (CME): New test facility for measuring the coefficientof moisture expansion of advanced composite materials (Romeo, Miraldi, Ruscica, Ber- toglio, Frulla, and Ruvinetti), Winter, 225 Composite cylinder: Simplified microme- chanical equations for thermal residual stress analysis of coated fiber …
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Method for Hygromechanical Characterization of Graphite/Epoxy Composite
1) measurement of coefficients of moisture expansion , (2) tensile testing of dry specimens in the transverse to the fiber direction, and (3) tensile testing of moisture-conditioned specimens in the transverse to the fiber direction.