Help with Hot Melt Adhesives specifications:
Substrate / Material Compatibility
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| Ceramic / Glass | Ceramics consist of oxides, carbides, nitrides, and other non-metals with high melting points. Ceramics are suitable for applications requiring wear resistance, thermal stability, and electrical resistivity. | ||
| Concrete / Masonry | Concrete and cements consist of a mixture of a binder or clinker and a coarser aggregate. They are used to patch or line floors and walls, bond brick, and join components for use in high-temperature applications. Clinker is a fused mineral or mineral mixture, such as alumina, bauxite, or lime, which is crushed into a fine powder. Aggregates are coarser, granular materials that are added to mortar, grout, or cement at mixing time to impart special properties such as thermal stability, wear resistance and oxidation resistance. Synthetic aggregates are fused mineral or mineral mixtures crushed to a coarse, granular size range rather than a fine, powdered clinker. Portland cement is the most common bond used in structural concretes and mortars. Polymer cements have a resin bond and are used in corrosion protection, mortars for corrosion-resistant floor tiles, and other specialized industrial applications. Masonry consists of tile, bricks, stone, or other ceramic components that are bonded together with mortar or adhesive. | ||
| Composites | Composite materials consist of a resin (suitable for molding) and a matrix (typically fibers or textile material) which serves to enhance strength, alter electrical or magnetic properties, or enhance wear resistance. | ||
| Metal | Metals are opaque, fusible, ductile, and typically lustrous substances that are good conductors of heat and electricity. They form cations by the loss of electrons and yield basic oxides and hydroxides. Metals that are used in structural engineering applications have a high toughness that is a combination of high strength and ductility. | ||
| Paper / Paperboard | Paper or paperboard products are produced from a pulp of cellulose, cotton, wood, or other vegetable fibers. The pulp is laid down on a fine screen from a water suspension to form sheets that are dried and further processed. | ||
| Plastic | Plastics are organic, synthetic, or processed materials that are mostly thermoplastic or thermosetting polymers of high molecular weight. They can be made into objects, films, or filaments. | ||
| Porous Surfaces | Substances are adhesives or sealants with a high viscosity or gel-like consistency. Typically, these materials have the ability to work with porous surfaces. | ||
| Rubber / Elastomer | Rubber and elastomers are characterized by a high degree of flexibility and elasticity (high reversible elongation). Natural or synthetic rubber is vulcanized to increase useful properties such as toughness and resistance to wear for use in tires, electrical insulation, and waterproof materials. Vulcanization is a chemical treatment that adds sulfur and heat to crosslink the rubber. Natural rubber is an elastic substance that is obtained by coagulating the milky juice of any of various tropical plants. Essentially, natural rubber is a polymer of isoprene, and is prepared as sheets and then dried. Synthetic rubbers or elastomers can be based on a variety of systems such as silicone, polyurethane or neoprene. | ||
| Textiles / Fabrics | Substances are adhesives or sealants suitable for coating, filling, sizing, or sealing non-woven or woven textiles. Sizing adhesives or resins are used to fill paper, textile webs, and other fibrous products. | ||
| Wood / Wood Product | Wood is a natural composite extracted from the stems, branches, and roots of trees. It is a hard, fibrous substance that consists of xylem, cellulose fibers in an amorphous, lignin polymer matrix. Lignin is a biogenetic cross linked polymer which bonds together adjacent cell walls into a straw or wood tissue composite. Cellulose is a polysaccharide (C6H10O5)x of glucose units that constitutes the chief part of the cell walls of plants. It occurs naturally in fibrous products such as cotton and kapok, and is the raw material of many manufactured goods as paper, rayon, and cellophane. | ||
| Other | Other unlisted, specialty, or proprietary substrates. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Dissimilar Substrates? | Adhesive or sealant systems can bond dissimilar substrates, such as metal to rubber. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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Industry / Applications
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| Aerospace | Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components. | ||
| Automotive | Products are designed for automotive applications. For example, they can be used to bond panels and seal windows. | ||
| Electronics | Products are designed for use in electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants. | ||
| Electrical Power / HV | Products are resins, compounds, and plastic composites that are suitable for electrical power or high voltage (HV) applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation. | ||
| Encapsulanting / Potting | Encapsulates and potting compounds are resins used to encapsulate circuit boards or semiconductor devices, fill a container of electronic devices, or infiltrate electrical coils to provide environmental protection and electrical insulation. Ceramic cement-based potting compounds are available for high-temperature applications. | ||
| Laminating / Composites | Products are designed for constructing laminating strip structures or SCRIMP matrix resins for composite construction. SCRIMP is an acronym for Seeman composites resin infusion molding process. | ||
| Marine | Products are designed for marine applications. They can be immersed in water and can withstand exposure to marine atmospheres. | ||
| Medical / Food (Sanitary / FDA) | Products are suitable for medical or food-contact applications. Typically, they they comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI. | ||
| Military / Government (MIL-SPEC / GG) | Products adhere to U.S. military specifications (MIL-SPEC). | ||
| OEM / Industrial | Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing, or fabrication of products. | ||
| Optical Grade / Material | Polymers or elastomers are designed for optical or photonics applications. Examples include transparent polycarbonate or acrylic lens materials. | ||
| Photonics / Optoelectronics | Products are designed for optoelectronics or photonics applications. Examples include cements for bonding simple lenses into compound structures. | ||
| Semiconductors / IC Packaging | Products are designed or are suitable for semiconductor or semiconductor packaging applications. | ||
| Building / Construction | Products are designed for use by construction contractors and in maintenance, repair, and operation (MRO) applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam), and bitumen-based roofing materials. | ||
| Tooling / Mold Material | Products are designed for tooling or mold fabrication such as polyurethane shapes or castable silicones. | ||
| Other | Other unlisted industries. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Material System
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| Chemical / Polymer System Type | |||
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| Acrylic / Polyacrylate | Acrylics feature excellent environmental resistance and fast-setting times. Acrylic polymers are produced from acrylic acids via a catalytic reaction. | ||
| Bitumen / Coal Tar | Bituminous adhesives are used in roofing and construction applications because of their water resistance and low cost. Bituminous substances are hydrocarbons that occur naturally as tar, or are derived as by-products from petroleum or coal refining. Coal tar is derived from the distillation of bituminous coal. | ||
| Glue / Gum | Animal glues include hide glues, casein or milk protein glues, and fish-based glues. Hide glues are produced by hydrolysis or by boiling collagen, protein, or gelatin from animal bones, hide, hooves, or horns. Collagen, hide glue, and gelatin are very closely related in terms of protein and chemical composition. Casein-based adhesives (carpenter's glues) are derived from milk. Vegetable glues are made from plant-based proteins or modified starches. Soy protein glues are finding increased application. Gum adhesives or mucilage are based on polysaccharides derived from various plant exudates such as an oleoresin or gum resin. Gum adhesives are gelatinous when moist and harden after drying. Gum adhesives are the salts of complex organic acids. Mucilage contains proteins and polysaccharides and is similar to vegetable plant-gum adhesives. Mucilage is a gelatinous substance extracted from legumes and seaweeds. | ||
| Polyester (PET) | Polyester (PET) is used as a hot-melt adhesive. | ||
| Polyamide | Polyamides are used to produce strong hot-melt adhesives with higher strength than either polyethylene or other hot-melt adhesives. Nylon is a well-known example of a polyamide engineering resin that is also used to mold plastic parts. | ||
| Polyethylene (PE) | Polyethylene (PE) is used as a hot-melt adhesive. | ||
| Polyester / Vinyl Ester | Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins. | ||
| Polypropylene (PP) | Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds. | ||
| Polyurethane (PU, PUR) | Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. PUR resins require a catalyst, heat, or air evaporation to initiate and complete curing. | ||
| Vinyl (PVC) | Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH). | ||
| Wax Based | Sealants or binders are based on a wax compound. Wax binders are commonly used to bind ceramic or metal powder during compaction processes because wax binders lubricate and burn-off thoroughly. The original hot-melt compounds were based on paraffin waxes. | ||
| Specialty / Other | Other specialty, proprietary, or unlisted resins, chemical systems or compound or polymer types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Filled / Reinforced? | Filled compounds consist of adhesives with additional modifiers such as pigments or chopped fiber reinforcements. Typically, filled compounds are ready-to-use. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Rubber Based / Elastomeric? | Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation). Natural rubber, synthetic rubber, or elastomer sealants and adhesives can be based on a variety of systems such silicone, polyurethane, chloroprene, butyl, polybutadiene, isoprene, or neoprene. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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Features
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| Features | |||
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| Thermal Compound / Thermally Conductive | Materials are designed to form a thermally conductive layer on the substrate, between components, or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulates, potting compounds, tapes, pads, adhesives and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation. | ||
| Thermal Insulation / Heat Insulating | Thermally insulating resins, plastics, compounds and encapsulates provide a thermal barrier between components and a hot or cold source. | ||
| Thread Locker / Retainer | Threadlocking or threadlocker adhesives bind threads that are subject to transverse and axial loads against vibrational loosening. They reduce production costs and improve reliability by eliminating lock washers and other expensive locking devices. Threadlockers also preserve on-torque and distribute the load over the entire engagement length of a fastener, effectively eliminating premature material fatigue and fastener failure. | ||
| UL Approved | The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL). | ||
| Anti-static / ESD Control | Anti-static materials have relatively high electrical conductivity or low electrical resistivity. They are used in electronic, anti-static, or electrostatic discharge (ESD) applications. | ||
| Electrically Conductive | Resins or compounds with a high degree of electrical conductivity (low resistivity) are used in applications such as anti-static or ESD control, EMI/RFI shielding, thick-film metallization, and device and board-level electrical interconnection. | ||
| Electrically Insulating / Dielectric | Dielectric compounds and electrical insulation materials form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components influence material selection, based on the dielectric strength to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths. | ||
| EMI / RFI Shielding Material | Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity. | ||
| Flame Retardant (e.g. UL 94 Rated) | The material is flame retardant in accordance with industry standards from Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. Flame-retardant materials are designed to reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to it. | ||
| Flexible / Dampening | Products are designed to provide flexibility or dampening of sound, vibration, or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Thermal Properties
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| Use Temperature | Use temperature is the range of temperatures a product can be exposed to without the degradation of structural or other required end-use properties. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Thermal Conductivity | Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)] | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Coeff. of Thermal Expansion (CTE) | Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Mechanical Properties
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| Elongation | Elongation is the amount of deformation as a percentage that occurs during a tensile test or other mechanical test. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Tensile Strength (Break) | Tensile strength at break is the maximum amount of stress required to break the material under tension-loading test conditions, or to cause failure. Typically, tensile tests are performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Electrical & Optical Properties
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| Dielectric Strength | Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Dielectric Constant (Relative Permittivity) | The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. As an equation, it is expressed as k = εr = ε / εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Index of Refraction | The index of refraction is a measure of the speed of light in a material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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