Glue / Gum Hot Melt Adhesives
from Ellsworth Adhesives
Elemelt HMS425 Amber is an APAO hot melt adhesive with a long open time used for bonding foam to foam, foam to fabric, and other porous substrates. Can be extruded or sprayed. 0.5 in x 10 in Stick, 22 lb Case. [See More]
- Chemical System: Gum
- Substrate Compatibility: Porous Surfaces; Textiles or Fabrics
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Tensile (Break): 4
from Ellsworth Adhesives
Elemelt HMS600-5-10A Amber is a high performance, medium setting, EVA based hot melt adhesive that is used for bonding wood. 1/2 in x 10 in Stick. [See More]
- Chemical System: Gum
- Substrate Compatibility: Composites; Wood
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Tensile (Break): 321
from Ellsworth Adhesives
Elemelt HMS601 Amber is a low melt hot melt adhesive used for packaging and carton sealing applications. Features excellent hot tack, good delivery rate, and a short open time. Bonds well to most porous materials. 0.5 in x 10 in Stick, 25 lb Case. [See More]
- Chemical System: Gum
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Ellsworth Adhesives
Elemelt HMS601 Amber is a low melt hot melt adhesive used for packaging and carton sealing applications. Features excellent hot tack, good delivery rate, and a short open time. Bonds well to most porous materials. 0.5 in x 15 in Stick, 25 lb Case. [See More]
- Chemical System: Gum
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Ellsworth Adhesives
Elemelt HMS701 Amber is a fast-setting hot melt adhesive with low temperature resistance used for corrugated carton sealing applications. Features excellent hot tack, good delivery rates, and a short open time. Bonds well to most porous materials such as a wood, paper, and cloth. 0.5 in x 10 in... [See More]
- Chemical System: Gum
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Ellsworth Adhesives
Elemelt HMS701 Amber is a fast-setting hot melt adhesive with low temperature resistance used for corrugated carton sealing applications. Features excellent hot tack, good delivery rates, and a short open time. Bonds well to most porous materials such as a wood, paper, and cloth. 0.5 in x 15 in... [See More]
- Chemical System: Gum
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Ellsworth Adhesives
Elemelt HMS702 Amber is a fast-setting hot melt adhesive used for corrugated carton sealing and small packaging applications. Features excellent hot tack, good delivery rate, and a short open time. Bonds well to some corrugated packaging and paper products. 0.5 in x 10 in Stick, 25 lb Case. [See More]
- Chemical System: Gum
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Ellsworth Adhesives
Elemelt HMS707 Black is a high performance hot melt adhesive used for difficult porous or non-porous substrates. Features good resistance at both low and ambient temperatures, as well as good delivery rates and a long open time. Bonds well to glass, leather, metals, magnets, ceramics, wood, ABS,... [See More]
- Chemical System: Gum
- Substrate Compatibility: Porous Surfaces
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Ellsworth Adhesives
Elemelt HMS707 Clear is a high performance hot melt adhesive used for difficult porous or non-porous substrates. Features good resistance at both low and ambient temperatures, as well as good delivery rates and a long open time. Bonds well to glass, leather, metals, magnets, ceramics, wood, ABS,... [See More]
- Chemical System: Gum
- Substrate Compatibility: Porous Surfaces
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Techsil Limited
Techsil ® PS-6675 is a pressure sensitive adhesive which has excellent adhesion to a wide range of substrates and excellent tack over a wide range of temperatures. Its medium viscosity allows excellent spray properties and clean coating characteristics. PS 6775 is suitable for use as a... [See More]
- Chemical System: Gum
- Type / Form: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Contact or Pressure Sensitive Adhesives
- Substrate Compatibility: Paper or Paperboard; Dissimilar Substrates