Electronics Hot Melt Adhesives
from MacDermid Alpha Electronics Solutions
Product Overview. STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip Modules (MCMs), its unique reworkable thermoplastic adhesive system provides... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Thermoplastic / Hot Melt; Thermoset
- Composition: Filled
from Ellsworth Adhesives
3M Hot Melt Adhesive 3779 Q Amber, formerly known as Jet-Melt, is a 100% solid, thermoplastic resin that is used for electrical applications. It offers resistance to high temperatures, oil, and fuel. 0.625 in x 8 in Stick. [See More]
- Industry: Electronics
- Substrate Compatibility: Wood
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from MacDermid Alpha Electronics Solutions
Product Overview. A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with GaAs and silicon wafer thinning. It can also be... [See More]
- Industry: Aerospace; Electronics; Sanitary; Semiconductors, IC's
- Cure / Technology: Thermoplastic / Hot Melt
from Ellsworth Adhesives
Power Adhesives Tecbond 7718 is a low viscosity, polyamide hot melt that is used for knot filling, wood repair, and potting and encapsulation in the electronics industry. It has a tough setting and short open time. Amber, 0.5 in x 12 in Stick. [See More]
- Industry: Electronics
- Substrate Compatibility: Wood
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Dielectric Strength: 762
from Ellsworth Adhesives
Power Adhesives Tecbond 7718 Hot Melt Adhesive Amber is a polyamide adhesive. It is used in potting and encapsulation in the electronics industry and knot filling/wood repair in the woodworking industry. 0.5 in x 12 in Stick, 11 lb Case. [See More]
- Industry: Electronics
- Substrate Compatibility: Wood
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Dielectric Strength: 762
from Ellsworth Adhesives
Power Adhesives Tecbond 7718 is a low viscosity, polyamide hot melt that is used for knot filling, wood repair, and potting and encapsulation in the electronics industry. It has a tough setting and short open time. Beige, 0.5 in x 12 in Stick. [See More]
- Industry: Electronics
- Substrate Compatibility: Wood
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Dielectric Strength: 762
from Ellsworth Adhesives
Power Adhesives Tecbond 7718 is a low viscosity, polyamide hot melt that is used for knot filling, wood repair, and potting and encapsulation in the electronics industry. It has a tough setting and short open time. Black, 0.5 in x 12 in Stick. [See More]
- Industry: Electronics
- Substrate Compatibility: Wood
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Dielectric Strength: 762
from Henkel Corporation - Electronics
Known as MACROMELT 6211 ). Macromelt ® 6211 ™ is a polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and ABS. It is an excellent adhesive for telecommunication and power cables. It is... [See More]
- Industry: Electronics
- Cure / Technology: Thermoplastic / Hot Melt
from Shenzhen DeepMaterial Technologies Co., Ltd
Easy to repair, fast curing, high elongation, low hardness. [See More]
- Industry: Electronics
- Type / Form: Encapsulant or Conformal Coating
- Cure / Technology: Thermoplastic / Hot Melt; Reactive or Moisture Cured
- Use Temperature: -40 to 176
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Type / Form: Pellets; Encapsulant, Potting Compound
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Substrate Compatibility: Plastic
from Shenzhen DeepMaterial Technologies Co., Ltd
In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and the bonding of various materials. After curing, the product has excellent flexibility and strength, making it... [See More]
- Industry: Electronics
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Thermoplastic / Hot Melt; UV or Radiation Cured
- Use Temperature: -67 to 302