Encapsulanting / Potting Hot Melt Adhesives
from Techsil Limited
Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot filling... [See More]
- Type / Form: Encapsulant, Potting Compound
- Cure / Technology: Thermoplastic / Hot Melt
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type / Form: Pellets; Encapsulant, Potting Compound
- Substrate Compatibility: Plastic
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Features: High Dielectric; Thermally Conductive; UL Rating
from Henkel Corporation - Industrial
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT ® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is... [See More]
- Type / Form: Encapsulant, Potting Compound
- Cure / Technology: Thermoplastic / Hot Melt