Semiconductors / IC Packaging Hot Melt Adhesives
2 Results
High-Reliability Thermoplastic Adhesives for Microelectronics -- STAYSTIK ® 181
from MacDermid Alpha Electronics Solutions
from MacDermid Alpha Electronics Solutions
Product Overview. STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip Modules (MCMs), its unique reworkable thermoplastic adhesive system provides... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Thermoplastic / Hot Melt; Thermoset
- Composition: Filled
High-Reliability Thermoplastic Adhesives for Microelectronics -- STAYSTIK ® 336T
from MacDermid Alpha Electronics Solutions
from MacDermid Alpha Electronics Solutions
Product Overview. A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with GaAs and silicon wafer thinning. It can also be... [See More]
- Industry: Aerospace; Electronics; Sanitary; Semiconductors, IC's
- Cure / Technology: Thermoplastic / Hot Melt