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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10.56 to 37.78 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.56
- Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Abrisa Technologies
Description: Abrisa Technologies offers Asahi Glass Corporation (AGC) EN-A 1 material, a highly transmissive, alkali-free thin boro-aluminosilicate glass that is ideal for highly sensitive bio-photo detection applications, high throughput sensor applications and as enhancement glass
- Applications: Biocompatible / Biomaterial, Dielectric / Electrical Insulation, Specialty / Other
- Density: 2.51 g/cc
- Glass Type: Aluminosilicate, Borosilicate
- Index of Refraction: 1.52 #
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Supplier: Aremco Products, Inc.
Description: Low cte, good strength, tubes, vessels, sensors
- Applications: Ceramics / Glass Manufacturing, Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Other, Refractory / High Temperature Materials
- Coeff. of Thermal Expansion (CTE): 7.20E6 µm/m-C
- Max Use / Curie Temperature: 1649 C
- Specialty Ceramic Type: Zirconia
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Supplier: Aremco Products, Inc.
Description: Good adhesion to metals, low cte metals
- Applications: Ceramics / Glass Manufacturing, Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Refractory / High Temperature Materials, Other
- Coeff. of Thermal Expansion (CTE): 7.74E6 µm/m-C
- Material Type: Alumina / Aluminum Oxide
- Max Use / Curie Temperature: 1649 C
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Supplier: Robuster Quartz
Description: Robuster Quartz Fused Silica Ceramics features excellent thermal reliability under high temperature (up to 1350°C), resistivity to chemical corrosion and thermal shock; Our Silica ceramic products are widely used in chemical, medical and biology industries for chemical synthesis
- Applications: Chemical / Materials Processing, Specialty / Other
- Glass Type: Quartz
- Length: 2.36 to 5.91 inch
- Max Use Temperature: 1200 C
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Supplier: Master Bond, Inc.
Description: addition of heat. Some other positives include low shrinkage upon curing, a low CTE and a high degree of dimensional stability. It bonds well to a wide variety of substrates including metals, composites, ceramics and most plastics.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): Over 4.8
- Dissimilar Substrates: Yes
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Supplier: Robuster Quartz
Description: Robuster Quartz Fused Silica Ceramics features excellent thermal reliability under high temperature (up to 1350°C), resistivity to chemical corrosion and thermal shock; Our Silica ceramic products are widely used in chemical, medical and biology industries for chemical synthesis
- Application / Industry: Chemical Processing
- Bottom Type / Pour Method: Round Bottom, Pouring Spout
- Capacity: 0.6102 to 12.2 cubic inches
- Crucible Products: Crucible - Conical / Tapered
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Supplier: MacDermid Alpha Electronics Solutions
Description: features a high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE), providing a high-reliability solution. Full Component Coverage Provides full component coverage when dispensed onto a substrate preheated to 70–100°C. Stringent
- Industry: Automotive, Electronics
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Supplier: Robuster Quartz
Description: Robuster Quartz Fused Silica Ceramics features excellent thermal reliability under high temperature (up to 1350°C), resistivity to chemical corrosion and thermal shock; Our Silica ceramic products are widely used in chemical, medical and biology industries for chemical synthesis
- Application / Industry: Chemical Processing, Foundry / Casting , Other
- Bottom Type / Pour Method: Round Bottom
- Capacity: 0.3051 to 9.15 cubic inches
- Crucible Products: Crucible - Conical / Tapered
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Supplier: Abrisa Technologies
Description: Abrisa Technologies’ Transparent Conductive Heaters incorporate coatings of Indium Tin Oxide (ITO), Index-Matched Indium Tin Oxide (IMITO) or Indium Molyb-denum Oxide (IMO) and are ideal window and display glass solutions when anti-fogging or de-icing, and high throughput and clarity
- Fuel / Energy Source: Electric
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Supplier: Dymax
Description: OP-60 high-performance optical adhesive cures upon exposure to UV or visible light in seconds. OP-60 is a low-shrinkage, low-outgassing, low-CTE adhesive designed for the precise positioning of lenses, prisms, and other optical components. OP-60 bonds to metal, glass, ceramic,
- Cure Type / Technology: UV / Radiation Cured (EB, Light)
- Dissimilar Substrates: Yes
- Viscosity: 150000 cP
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Supplier: Henkel Corporation - Electronics
Description: . Liqui-Bond SA 1800’s mild elastic properties assist in relieving CTE stresses during thermal cycling. The material cures at elevated temperatures and requires refrigeration storage at 10°C. Liqui-Bond SA 1800 is available with optional glass beads to provide a consistent stand-off
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: General Plastics Manufacturing Co.
Description: affordable, General Plastics™ FR-4700 Series products offer outstanding stability and versatility. Their higher glass transition temperature and low coefficient of thermal expansion (CTE) make them suitable for use in vacuum-forming applications where other urethane products may soften
- Industry Served: Aerospace, Marine, Medical
- Location: North America, United States Only, Northwest US Only
- Services: CAD/CAM Support, Design Assistance, Prototyping
- Type: Custom / Specialty Tools
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customized services. LTCC ceramic package shell LTCC (Low Temperature Co-fired Ceramic) is a multilayer ceramic substrate, the main components of which are alumina and glass, and high conductivity metals such as gold, silver, and copper are used as conductor pastes (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
EP5LTE-100 has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance. EP5LTE-100 passes NASA (read more)
Browse Leveling and Filling Compounds Datasheets for Master Bond, Inc. -
the laminate supplier used. Thermal Stability: High-speed circuits generate significant heat. Materials with high glass transition (Tg), decomposition temperature (Td), and low coefficient of thermal expansion (CTE) prevent warpage and via stress. Boards should be qualified to IPC-6012 for (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
temperature, low CTE tooling board offers outstanding stability and versatility. Its higher glass transition temperature and low coefficient of thermal expansion (CTE) makes it suitable for use in vacuum-forming applications where other urethane products may soften or deform. (read more)
Browse Tool and Die Makers Datasheets for General Plastics Manufacturing Co. -
supplier used. Thermal Stability: High-speed circuits generate significant heat. Materials with high glass transition (Tg), decomposition temperature (Td), and low coefficient of thermal expansion (CTE) prevent warpage and via stress. Boards should be qualified to IPC-6012 for general digital (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect
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P‐197L: Late‐News Poster : Impacts of Glass Substrate and Frit Properties on Sealing for OLED Lighting
Even for high CTE glass substrates, the lower CTE frits produce more robust sealing.
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Calcium Zinc Borosilicate Glass with High Thermal Expansion Coefficient for LTCC Applications
existing works.6–10 As the developed high CTE glass is aimed to be applied as a dielectric material, the dielectric constant of the glass has been also estimated and compared with the predicted value based on Eq. (1) as reference data.
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P‐184L: Late‐News Poster : Transient Thermal Stress Modeling of the Laser Frit Sealing Process
The results explained why high CTE glass is hard to seal.
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Microporous and Thin Film Membranes for Solid Oxide Fuel
• Calcium-strontium alumino-pyrosilicate and calcium-zinc pyrosilicate phases are desirable crystalline phases which appear to stabilize the formation of higher CTE glass - ceramics in compositions like G#27 and G#42.
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Fabrication Methods for Precision Optics
Even glasses with much lower CTE should be treated with care when they are hot, but the high CTE glasses warrant extraordinary attention.
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Solder Joint Reliability Prediction for Multiple Environments
High CTE Glass .
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Couple: an integrated model for optical interconnect modules
It is clear that an alternative to this high CTE glass cover should be investigated.
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Thermo-Mechanical Reliability of High-End Flip Chip BGA Packages: Comparison Heat Spreader and Motherboard Construction
As a result, a new material to be used is the high CTE Glass ceramic to improve the solder join fatigue lifetime.
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Optical Design of Microscopes
The higher CTE glass may crack during rapid change in temperature.
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Electronic Materials and Processes Handbook, Third Edition > Ceramics and Glasses
Kyocera’s HITCE system, formulated with high CTE glass and crystalline filler having a combined CTE of 11.5ppm/°C, is well suited for applications wherein the ceramic is to be attached to a PWB with a CTE in the 12 to 16ppm/°C range.