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Supplier: Douglas Electrical Components
Description: MIL-DTL-26482 Series I and Series II connectors, formerly MIL-C-26482, are two series of quick-disconnect miniature circular connectors with three-point bayonet coupling mechanisms used to connect systems requiring power and signal in military and defense environments. These connectors are
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Supplier: AVX Corporation
Description: cost of replacing a faulty component. Available in various configurations from miniature and subminiature, bolt-in, solder-in, and cylindrical hermetically sealed styles, these filters offer superior reliability and performance in critical applications.
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Supplier: APITech
Description: API's line of miniature solder-in filters are hermetically sealed on one end for through-hole sealing between compartments, allowing it to be soldered into a package, bracket, or bulkhead while maintaining hermetically. The high-temperature construction meets military
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Supplier: Palomar Technologies, Inc
Description: sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules EMI filters Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable
- Application: Brazing / Soldering, Curing, Industrial, Other
- Computer Interface: Yes
- Configuration: Top Loading
- Controller Type: Programmable
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Supplier: Palomar Technologies, Inc
Description: Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages Miniature crystals MMICs Oscillators Pacemakers Power modules Pressure sensors Resistor networks RF
- Application: Brazing / Soldering, Curing, Other
- Configuration: Top Loading
- Controller Type: Programmable
- Height: 483 mm
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Supplier: Palomar Technologies, Inc
Description: Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages Miniature crystals MMICs Oscillators Pacemakers Power modules Pressure sensors Resistor networks RF
- Temperature Range: 842 F
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A passive humidity monitoring system for in situ remote wireless testing of micropackages
A miniature implantable hermetic package with multiple feedthroughs using glass–silicon anodic bonding technology has been developed for biomedical applications [1].
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Wireless implantable microsystems: high-density electronic interfaces to the nervous system
Recently, wafer bonding and micromachining techniques have made it possible to realize miniature hermetic packages with the required feedthroughs .
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Reliability investigations and improvements of interconnection technologies for the wireless brain-machine interface — ‘BrainCon’
… on Active Implantable Medical Devices”, Proc. IEEE Reliability Physics Symposium (IRPS), pp. 3B.1.1-1.7, 2011 [3] M. Schuettler, J.S. Ordonez, et al.: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Feedthroughs ", Proc. IEEE EMBC …
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Ensuring minimal humidity levels in hermetic implant housings
[3] M. Schuettler, J.S. Ordonez, T. Silva Santisteban, A. Schatz, J. Wilde, T, Stieglitz: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Feedthroughs ", Proceedings of the Annual International Conference of the IEEE EMBC, pp. 1586-1588, 2010.
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Towards Practical Brain-Computer Interfaces
Schuettler, M., Ordonez, J.S., Santisteban, T.S., Schatz, A., Wilde, J., Stieglitz, T.: Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs .
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Miniaturized neural interfaces and implants
[49]Schuettler, M., Ordonez, J.S:, Silva Santisteban, T., Schatz, A., Wilde, J., and Stieglitz, T., "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs ".
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Retinal Prosthesis
[31] M. Schuettler, J. S. Ordonez, T. S. Santisteban, A. Schatz, J. Wilde, and T. Stieglitz, “Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs ,” in Proc. 32nd Eng. Med. Biol. Soc. Conf., 2010, pp. 1585–1588.
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Program in chronological order
Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs ............
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A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packages
[2] M. Schuettler, J.S. Ordonez, T. Silva Santisteban, A. Schatz, J. Wilde, T. Stieglitz: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs ", Submitted to the IEEE EMBC 2010.
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Microstructural analysis of alloy 718 welds to Kovar and 304L
Hermetic miniature electromechanical and electrochemical components require headers containing glass-to-metal seals through which electrical feedthroughs are made.