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Supplier: AVX Corporation
Description: Chassis Mount Broadband Feedthrough Filters AVX Chassis Mount Feedthrough Filters are designed for high reliability applications. These applications have diverse requirements, including the need for a long operating life in medical, space, or military systems to avoid the prohibitive
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Supplier: APITech
Description: API's line of miniature solder-in filters are hermetically sealed on one end for through-hole sealing between compartments, allowing it to be soldered into a package, bracket, or bulkhead while maintaining hermetically. The high-temperature construction meets military requirements for
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Supplier: Douglas Electrical Components
Description: flexibility – convert virtually any non-hermetic 26842 connector into a hermetic connector design. While glass-to-metal seal connectors have a limited range of hermetic connector options, our technology permits us to hermetically seal all pin and shell sizes. Integrate a custom
- Voltage Rating: 1,000 volts
- Connector Type: Military Connector
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Supplier: Schott Japan
Description: components. All of our autoclavable medical connectors and feedthroughs are custom made and can be entirely modified to suit your specific application. Advantages Ability to offer extremely miniaturized ceramic feedthroughs that are particularly suited for endoscopy applications. Full
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Supplier: Palomar Technologies, Inc
Description: and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
- Temperature Range: 212 to 932 F
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Supplier: Palomar Technologies, Inc
Description: Single chamber process Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to
- Process Temperature: 450 C
- Height: 482.59973939614076 mm
- Width / Tube O.D.: 774.6995816622259 mm
- Length (Chamber / Tube): 634.9996571001852 mm
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Supplier: Palomar Technologies, Inc
Description: Single chamber process Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to
- Temperature Range: 842 F
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A passive humidity monitoring system for in situ remote wireless testing of micropackages
A miniature implantable hermetic package with multiple feedthroughs using glass–silicon anodic bonding technology has been developed for biomedical applications [1].
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Wireless implantable microsystems: high-density electronic interfaces to the nervous system
Recently, wafer bonding and micromachining techniques have made it possible to realize miniature hermetic packages with the required feedthroughs .
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Reliability investigations and improvements of interconnection technologies for the wireless brain-machine interface — ‘BrainCon’
… on Active Implantable Medical Devices”, Proc. IEEE Reliability Physics Symposium (IRPS), pp. 3B.1.1-1.7, 2011 [3] M. Schuettler, J.S. Ordonez, et al.: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Feedthroughs ", Proc. IEEE EMBC …
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Ensuring minimal humidity levels in hermetic implant housings
[3] M. Schuettler, J.S. Ordonez, T. Silva Santisteban, A. Schatz, J. Wilde, T, Stieglitz: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Feedthroughs ", Proceedings of the Annual International Conference of the IEEE EMBC, pp. 1586-1588, 2010.
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Towards Practical Brain-Computer Interfaces
Schuettler, M., Ordonez, J.S., Santisteban, T.S., Schatz, A., Wilde, J., Stieglitz, T.: Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs .
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Miniaturized neural interfaces and implants
[49]Schuettler, M., Ordonez, J.S:, Silva Santisteban, T., Schatz, A., Wilde, J., and Stieglitz, T., "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs ".
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Retinal Prosthesis
[31] M. Schuettler, J. S. Ordonez, T. S. Santisteban, A. Schatz, J. Wilde, and T. Stieglitz, “Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs ,” in Proc. 32nd Eng. Med. Biol. Soc. Conf., 2010, pp. 1585–1588.
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Program in chronological order
Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs ............
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A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packages
[2] M. Schuettler, J.S. Ordonez, T. Silva Santisteban, A. Schatz, J. Wilde, T. Stieglitz: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs ", Submitted to the IEEE EMBC 2010.
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Microstructural analysis of alloy 718 welds to Kovar and 304L
Hermetic miniature electromechanical and electrochemical components require headers containing glass-to-metal seals through which electrical feedthroughs are made.