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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, high-current, reliable, durable) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: Sensata Technologies
Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal
- Contact Plating: Gold Plating
- Contact Resistance: 200 milliohms
- Operating Temperature: 150 C
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: Sensata Technologies
Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications
- Contact Plating: Gold Plating
- Contact Resistance: 20 milliohms
- Contacts Pitch: 0.3200 mm
- Current Rating: 4 amps
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Supplier: Sensata Technologies
Description: Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ?Highly reliable M-pin Probes as contact parts ?High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10
- Contact Resistance: 100 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
- Operating Temperature: -40 to 150 C
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: to +125 °C Consistent stable contact resistance 120 m? (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature test. Contactor
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.8000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature test. Contactor
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.6500 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood Electronics Giga-Spring™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 1.27 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood Electronics Giga-Spring™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 1.27 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 40
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 48
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 48
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 32
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs)>Linear>Amplifi ers>Video Amps and Modules Package: 23-PowerQFN Product Status: Obsolete Contact Type: Female Socket Style: C Number of Positions: 5 Number of Positions Loaded: All
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Sensors, Transducers>Motion Sensors>Gyroscopes Package: 16-DIP (0.300" 7.62mm) 8 Leads Product Status: Active Contact Type: Female Socket Pitch: 0.200" (5.08mm) Row Spacing: 0.165" (4.20mm
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contact is designed for testing LGA, QFN, QFP and other variants. Contact our product specialists today to find out more. Ask the Expert (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
. Our portfolio contains both the standard type and reverse type with push-push, push-pull and hinge versions. If you are unable to locate the product you're looking for, please contact us for assistance. SD Card Sockets Product Series - SD card PCB mount socket (read more)
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Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd.
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Loranger International Corporation QFN Sockets
Contacts QFN Sockets .
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QFN 0.5 mm Pitch Test & Burn-In Sockets
The new open top QFN socket series have a high-reliable fine pitch 0.5 mm contact system and a standard socket scaling.
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QFN Test & Burn-In Socket from Yamaichi
The new open-top QFN socket series has a high-precision 0.4 mm or 0.5 mm fine pitch contact system with a compact socket construction at the same time.
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QFN
QFN Sockets Depth-controlled Wiping Contact .
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Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
According simulation results, each ports of this novel QFN socket contactor are impedance matching up to 20GHz bandwidth because the return loss is very smaller than -20dB and insertion loss approximate 0dB. … the design formulas derivate in this paper, designer can estimate the effect of contacts which may influence …
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Pads / Sockets
Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs .
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Pads / Boards
Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs .
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Pads / Probes
Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs .
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Package Test / ATE
QFN /QFP/MLF - High Performance ATE Test Sockets for Chipscale Packages Ardent's patented Scrub-R contact technology is designed for unparalleled AC performance coupled with consistent contact force …
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UWE Electronics Off-Set Kelvin Test Sockets
Kelvin Probes Test Sockets Boards Contacts Kelvin Loads Probes QFN Sockets .