-
Supplier: Gilson Company, Inc.
Description: is oscillated at a known torque. Dynamic shear modulus and phase angle properties are measured. HM-86 Air-Bearing DSR tests asphalt binder in standard QC/QA testing and some research applications. The instrument can be operated in strain control or stress control modes. The system
-
Supplier: Gilson Company, Inc.
Description: is oscillated at a known torque. Dynamic shear modulus and phase angle properties are measured. HM-86 Air-Bearing DSR tests asphalt binder in standard QC/QA testing and some research applications. The instrument can be operated in strain control or stress control modes. The system
-
Supplier: Henkel Corporation - Industrial
Description: /m-K Highly conformable, low hardness "Gel-like" modulus Decreased strain Puncture, shear and tear resistant Electrically isolating
- Chemical / Polymer System Type: Silicone
- Thermal Conductivity: 1 W/m-K
- Use Temperature: 76 to 392 F
-
-
Supplier: Henkel Corporation - Industrial
Description: . Thermal conductivity: 1.0 W/m-K Highly conformable, low hardness "Gel-like" modulus Decreased strain Puncture, shear and tear resistant Electrically isolating
- Chemical / Polymer System Type: Silicone
- Thermal Conductivity: 1 W/m-K
- Use Temperature: 76 to 392 F
-
Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The
- Compound Type: Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Thermal Conductivity: 3.5 W/m-K
- Use Temperature: 76 to 392 F
-
Supplier: Henkel Corporation - Industrial
Description: modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material. Thermal Conductivity: 1.0 W/m-K Highly Conformable, low hardness “Gel-like”
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 0.1000 W/m-K
- Use Temperature: 76 to 392 F
-
Supplier: Henkel Corporation - Electronics
Description: Bond-Ply LMS 500P is a thermally conductive laminate with a polyimide film substrate.The product consists of a high performance thermally conductive low modulus silicone compound coated both sides of a polyimide film, and double lined with protective films.The low modulus
- Industry: Electronics
-
Supplier: Henkel Corporation - Electronics
Description: Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
Find Suppliers by Category Top
Conduct Research Top
-
Thermal-Mechanical Decoupling by a Thermal Interface Material
Thermal-mechanical decoupling by a silicone thermal interface material (TIM) is one of the most important properties in electronic applications involving a printed circuit board (PCB). Thermal-mechanical decoupling requires that the thermal interface material have low shear modulus and high
-
Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
stable from 8 to 200 psi of pressure offer excellent performance in pad applications such as transistor to heatsink mounting. The addition of high shear strength and low shear modulus offer excellent performance in adhesive applications such as photovoltaic to heatsink mounting where performance
More Information Top
Indicates content that may require registration and/or purchase.
-
An analysts of the longitudinal mode quartz tactile sensor based on the Mason equivalent circuit
Measured values of density and shear modulus for silicone rubber .
-
Finite Element Analysis of a Structural Silicone Shear Bead Used in Skylight Applications
Common sealant cross-sections, subjected to both shear and tension will produce the greatest amount of deformation due to shear forces.[4] The shear modulus of silicone sealant is 1/3 of the tensile modulus, and bending reduces the lateral stiffness even more.
-
Thermal-Mechanical Decoupling by a Thermal Interface Material
An analysis of the thermal- mechanical decoupling mechanism is included, as well as an introduction to viable approaches to lower the shear modulus of a silicone Thermal Interface Material.
-
The Waterborne Coatings Symposium, 40th symposium, 2013
In general, the curing rate, hardness and shear modulus of all silicone polyether modified epoxy coatings is lower than the control.
-
The Effect of Saturation On Shear Wave Anisotropy In a Transversely Isotropic Medium
From the experimental data, water-saturated samples exhibited a decrease in shear modulus , while silicone oil-saturated samples showed an increased in shear modulus (for data from propagation direction C to A in the fully saturated case).
-
Finite element simulation of mechanical property evolvement of silicone rubber in the hot vulcanizing process
Equation (13) is fitted into eqn (10) to give the numerical expression of shear modulus Gn of silicone rubber in the time phase n .
-
Dynamic Behavior of Materials, Volume 1
Figure 16.6 plots the frequency dependent shear storage modulus for silicone gels as a function of the molecular weight of the m-PDMS solvent.
-
Examination of a junction-box adhesion test for use in photovoltaic module qualification
The sudden drop in shear modulus for the silicone at - 34°C would be catastrophic if the silicone was not cross-linked (as evidenced by the stable shear modulus above that temperature).
-
Examination of a Junction-Box Adhesion Test for Use in Photovoltaic Module Qualification: Preprint
The sudden drop in shear modulus for the silicone at -34°C would be catastrophic if the silicone was not cross-linked (as evidenced by the stable shear modulus above that temperature).
-
Accuracy and reliability of a dynamic biomechanical skin measurement probe for the analysis of stiffness and viscoelasticity
• G∗ is the effective shear modulus of the silicone elastomers • P is the total load required to achieve punch penetration • ν is Poisson’s ratio • a is the radius of the punch and • D is the indentation displacement…