Products & Services
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Supplier: Rigaku Corporation
Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 to 300 mm
- Measurement Capability: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
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Supplier: SPIE - Education
Description: DFM process so that his/her design can be fabricated by the target manufacturing partner/vendor on specific equipment. We will review such DFM for wafer fab via optical lithography (tape-out process), single point diamond turning (SPDT), or holographic optics recording specification.
- Modality: On-site / In Plant
- Technology / Subject: Instruments / Sensors, Photonics / Optics
- Type: Course
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Supplier: SPIE
Description: and defect control: inspection, repair, verification strategies, pellicles, in fab • Simulation and imaging: mask transfer to wafer (LER, SWA, surface roughness) • Nanoimprint lithography tools, mask, transfer, and resists • Deep learning mask technology applications
- Frequency: Annually
- Industry: Electronics and Semiconductor
- Type: Conference, Exhibition
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Supplier: SPIE - Education
Description: the design (1) and modeling tasks (2), the optical engineer needs to perform a DFM process so that the resulting design can be fabricated by the desired manufacturing partner/vendor over a specific equipment. We will review such DFM for wafer fab via optical lithography (tape-out
- Industry: Electronics
- Modality: On-site / In Plant
- Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Electronics, Photonics / Optics
- Type: Course
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Semiconductor Metrology Instruments
(191 Companies)
Wafer and Thin Film Instrumentation
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. Applications: Wafer clamping in semiconductor exposure tools Wafer (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
are widely used in wafer inspection stages, lithography scanners, metrology tools, and dicing equipment. Technical Highlights Uniform Air Permeation— Controlled porosity of 35–45% with pore sizes from 10μm to 100μm ensures consistent gas flow distribution across the (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Wafer clamping in photolithography and etching tools Secure wafer transfer between (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
provide a rigid guiding baseline across high-end automated infrastructure layout configurations: Semiconductor Fabrication Machinery: Wafer handling end-effectors, metrology stages, and automated track platforms requiring high repeatability. Flat Panel (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
Flexible Tooling and Integration The F-690.S1 SpaceFAB 6-DOF motion platform and alignment system is available with optional fiber and fiber array holders (model F-690.A1), featuring reversible fixture mounts for single fiber or array alignment. All necessary cables and (read more)
Browse Multi-axis Positioning Systems Datasheets for PI (Physik Instrumente) L.P. -
. Typical Applications • Lithography tools: optical lithography steppers and scanners, e-beam & laser mask writers • Metrology tools: Mask and wafer inspection and measurement tools, CD-SEMs • Calibration: Measurement and calibration (read more)
Browse Semiconductor Metrology Instruments Datasheets for Zygo Corporation -
Marposs has been a trusted partner in delivering advanced measurement solutions for the semiconductor industry. Thanks to deep expertise in metrology and wafer inspection, we support customers in identifying the most suitable solutions for monitoring material thickness and the so (read more)
Browse Dimensional Gages and Instruments Datasheets for Marposs Corp -
essential. Horizon leverages interferometry to achieve nanometer-level resolution, ensuring exceptional repeatability and long-term measurement stability. By eliminating mechanical contact, it minimizes drift and wear, making it the ideal solution for wafer inspection (read more)
Browse Signal Conditioners Datasheets for Marposs Corp -
chip die bonding application and up to 180 kUPH for µ-LED bonding. TELICA is available in two standard variants: variant 1 for Wafer Level Packages (WLP) with X410 x Y445 x Z30 mm travels and (read more)
Browse Multi-axis Positioning Systems Datasheets for ETEL S.A. -
stringent requirements on a routine basis, but to ramp up to produce such components in volume if need be. Assuring that components meet or exceed specification is an integral part of the manufacturing process. Depending on the type of component, we use a number of metrology tools for ensuring (read more)
Browse Optical Manufacturing Services Datasheets for Zygo Corporation
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
market collapse, says report China to blame for spot declines? Semicon West to move into one venue in 2005 Wafer metrology moving into era of convergence Auction set for 250 fab tools from PHS MEMS Novellus raises Q2 forecast amid chip-equipment demand Ethernet startup announces $15 million Series B
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
into SOC business, says Taiwanese executive IMS to provide tools for Advantest logic testers Samsung orders RDRAM testers from Schlumberger Motorola tips its RF IC strategy, revealing GaAs FET and SiGe amp Zygo metrology tool increases precision of wafer planarity measurement Intel invests
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EUV Lithography
Installations costs for fab wafer metrology tools often are the lowest cost to install since they require mainly house gas, electricity, chilled water, and other standard services.
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ZYGO Announces Advanced Film Capability Enabling Consolidation Of Process Control Equipment
Middlefield, CT - Zygo Corporation recently announced that it has introduced Advanced Film Capability ("AFC") to its line of fully automated in- fab wafer metrology tools .
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7.23.08 -- Feature Article: Nano-Sized Electronic Circuit Promises Bright View Of Early Universe
Zygo Corporation recently announced that it has introduced Advanced Film Capability to its line of fully automated in- fab wafer metrology tools .
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Some surface and interface characterization and metrology requirements in the wafer processing industry
The Theta 300 is more of a lab instrument, but it can be used in a metrology mode, whereas the RVX 1000 and VeraFlex are intended as wafer fab dedicated metrology tools .
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Improving lithographic performance for 32 nm
The monitor wafers are only measured a few times per week, which reduces the overall loading on the fab metrology tools and can afford wafer metrology samples at much denser inter- and intra-field frequencies.
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Plasma etch process characterization: an application of atomic force microscopy
The type, amount, and accuracy of the data generated, and the saving on wafer cost make AFM a attractive fab metrology tool .
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DualBeam metrology: a new technique for optimizing 0.13-um photo processes
… FIB column and a high-resolution electron column on a single full wafer platform.6 The physical dimensions of the tool, facility requirements, and user interface are similar to other metrology tools commonly found in a typical wafer fab (see Figure 1).
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Overlay excursion management through sample plan optimization and cycle time reduction
Metrology tool configuration and wafer flows specific to the fab operation are incorporated in the model.
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Application development of virtual metrology in semiconductor industry
In current FAB operation, production wafers need to go through metrology tools for on-line wafer metrology to assure wafer .
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Automated CD-SEM metrology for efficient TD and HVM
CD-SEM placement within FAB , proximity to other metrology and process tools , wafer stokers and staging areas, staffing by CD-SEM cluster can also impact metrology robustness and performance.