-
Supplier: Schmalz Inc.
Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers
-
Supplier: Schmalz Inc.
Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers
-
Supplier: Schmalz Inc.
Description: Wafer gripper for extremely fast and gentle handling of wafers and solar cells in the production processes Loading and unloading from stacks and conveyor belts Exact positioning during the visual inspection and position measurement allow for on-the-fly breakage detection during
-
-
Supplier: Schmalz Inc.
Description: Wafer gripper for extremely fast and gentle handling of wafers and solar cells in the production processes Loading and unloading from stacks and conveyor belts Exact positioning during the visual inspection and position measurement allow for on-the-fly breakage detection during
-
Supplier: MicroSense, LLC
Description: hour 2D & 3D mapping capability Full SECS/GEM compatibility Automated calibration Options Edge gripper/non-contact handling Extended warp/bow range up to 5000um Wafer prealigner Roughness measurement Applications High volume wafer production control, backgrinding control,
- Maximum Wafer / Part Size: 100 to 300.00000000000006 mm
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
- Features: Non-contact
-
Supplier: Soft Robotics Gripper
Description: It is used for high-precision plug and pull of small electronic parts. Assembling, sorting, testing and packaging of ceramic and plastic parts in mobile phone, PCBs, silicon wafers, optic glasses.
-
Supplier: 3X Ceramic Parts Company Limited
Description: system DOA equipment integrated wafer loading & unloading, unloading the wafers from the Ceramic boat to the cassette or loading the wafers from the cassette to the ceramic boat. Available for double back-to-back wafers in one slot which realize single side diffusion or
- Density: 5.99999621323765 g/cc
- Thermal Conductivity: 2.5 W/m-K
- MOR / Flexural Strength: 116,029.4714857576 psi
- Compressive / Crushing Strength: 290,073.678714394 psi
-
Supplier: VAST STOCK CO., LIMITED
Description: Transimpedance Amplifiers quarter-wafer on grip ring
- Features: Other
-
Supplier: Precision Polymer Engineering Ltd.
Description: High purity, Perlast® and Kimura® materials are widely used in wafer handling applications as end-effector pads because they provide optimized friction to maintain wafer positional accuracy, and prevent particulation due to their wholly organic nature. PPE are experts in providing
-
Supplier: DigiPas Technologies Inc.
Description: pictures can be obtained with near-free of parallax leaving less time required for post-processing adjustments in Photoshop. Digi-Pas® DWL-80E 2-Axis Ultra Precision Digital Level is used for installation, setup & maintenance very precision measurement instruments in wafer foundry. Digi-Pas®
- Angular Range: 0 to 90 degrees
- Angular Resolution: 0.1 degrees
- Reading Method / Display: Digital Display
- Measuring Technology: Electronic
Find Suppliers by Category Top
Featured Products Top
-
.5%) and silicon carbide (SiC 99%) with precision-machined fork geometry. The slim ceramic fork provides the stiffness required for high-speed wafer transfer while minimizing robot arm inertia. Edge grip features and vacuum ports are machined into the fork to support different wafer handling methods (read more)
Browse Industrial Ceramic Materials Datasheets for Fountyl Technologies Pte. Ltd. -
formats. Flat or grooved surface. Custom OD and vacuum hole patterns available. - Ring chucks -- Annular design for edge-grip wafer clamping. ID matched to wafer edge exclusion zone. Surface and Dimensional Tolerances - As-sintered surface -- Ra <= 3.2um, for general chamber (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd.
More Information Top
-
Precision Connector Assembly Automation
Wafer Gripper .
-
Automated Manufacturing of High Efficiency Modules: Final Subcontract Technical Status Report, 21 March 2005 - 31 August 2007
Wafer gripper used for cell stringing..............................................................
-
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
Furthermore, the tool still retains its capability to handle wafers with the wafer gripper that is a part of the robot arm.
-
MECHANICAL PROPERTIES OF NEAR-FRICTIONLESS HYDROGENATED
AMORPHOUS CARBON FREESTANDING THIN FILMS
FOR MEMS DEVICES
The 4-inch wafer was mounted on a 5-inch silicon substrate with wafer gripper to fit the 5 inch holder for AOE.
-
Technical acoustics
Levitation: Acoustic sonotrode of an ultrasound- wafer gripper and particles floating between it that are contactlessly held in the ultrasound-standing wave field.
-
Adaptronics and Smart Structures
Experimental applications for robotic devices and grippers (such as silicon wafer grippers ) have proven the feasibility of such actuators [72].
-
Contamination and ESD Control in High Technology Manufacturing
Wipe the wafer gripper with an Alpha 10 wiper wetted with IPA and blow dry with the ionized air gun.
-
Advanced process control system for vertical furnaces
In order to achieve reliable wafer loading, a mechanical wafer gripper was implemented which contacts the wafers only at three points along the wafer i-mi The angle of incidence of the measuring beam onto the wafer (700 to 75°) and the…
-
300 mm factory automation experience and challenges for wafer foundry fabs
To adjust all kinds of wafer gripper of tools to adopt with different types of FOUPs is very difficult.
-
16th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes; Program, Extended Abstracts, and Papers
As the surface (wafer) is drawn to the gripper, the surfaces of the wafer and gripper are separated by rubber standoffs.
Indicates content that may require registration and/or purchase.