Announcements

Indium Corporation has promoted these products / services:

Indium Corporation - Low Temperature Alloys - Soldering 101

The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the most popular Pb-free alloys melt in the 220°C to 225°C. But, what do you do if you need a solder that reflows at a lower temperature? (read more)

Indium Corporation - Solder...high reliability SACM™

Indium Corporation's - new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling - all at a cost below that of typical SAC solder alloys (read more)

Indium Corporation - Solder Alloy..SACM Improves Drop Shock Performance

Indium Corporation - The portable electronics industry has ongoing challenges to improve drop-shock performance without sacrificing thermal cycling performance, reduce need for expensive board-level underfills (and associated material, process and re-work costs), as well as the inability to even reach some areas with underfill; and reduce costs. (read more)

Indium Corporation -  Solder Paste - Remarkable New Product

Indium Corporation - Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace. (read more)

Indium Corporation - Gallium Trichloride, Anhydrous

Indium Corporation - Gallium trichloride (GaCl3) dissolves in virtually all solvents and thus is the ideal precursor for gallium derivatives: Gallium trichloride is the starting material for making gallium-based metal-organic precursors. (read more)

Indium Corporation - New Water-Soluble Solder Paste Flux- Indium6.4R

New...Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. (read more)

Indium Corporation - Best Metallization For Your Application

Indium Corporation - Since the NanoBond®process is almost instantaneous, fluxes are not used. (They just don’t have enough time to heat up to their activation temperature and remove oxides.) So, because this is a fluxless soldering application, surface choice and preparation become very important. Read this article in the series on Nanofoil® thin... (read more)

Indium Corporation - Soldering Products Meet New Requirments

Indium Corp. Introduces a full line of soldering products that satisfy IPC’s J-STD004B stricter requirements for measuring halogens and electromigration risk. Indium Corporation’s full line of PCB assembly products specifically designed to meet new international standards, which help to improve both first pass yields and long-term reliability. (read more)

Indium Corporation - Adding Solder to a NanoBond® Assembly

TECHNICAL INSIGHT:

One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin), it is really a heat source. A NanoBond® requires solder, whether it comes from a plating on the joining surfaces, additional solder preforms, or on the NanoFoil® itself. (read more)

Indium Corporation -  NanoFoil®... Instantaneous Heat Source

Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... (read more)

Indium Corporation - InFORMS® Reinforced Solder

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany. (read more)

Indium Corporation - Solder Alloys...Gold Based Advantages

Indium Corporation - These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages... (read more)

Indium Corporation - New Solder Paste.. high Pb-containing applications

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semi... (read more)

Indium Corporation -  Solder Paste...Package-on-Package

Indium - 9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. (read more)

Indium Corporation -  Thermal Interface Material...Heat-Spring®

Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. (read more)

Indium Corporation -  Solder Preform Placement...SUPER-FAST

Indium Corporation - Solder preform placement is tremendously faster using InTEGRATED® SOLDER PREFORMS. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion. Used in a variety of applications that require precise amounts of solder, dimensions can be held to tight tolerances to assure volume... (read more)

Indium Corporation - New... Solder Paste Technology - BiAgX™

Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... (read more)

Indium Corporation -  Flux Coatings-reduce voiding w/Solder Preforms

Indium Corp. - Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the bigger the challenge. For some time now I have been suggesting the use of a preform with flux coating as an approach to help reduce voiding. Logically, if you introduce less flux you entrap less... (read more)

Indium Corporation - Solder Research Kits - To Test your Options

Indium Corporation - We offer solder wire, solder ribbon and research kit options so you can more easily find a solution to your application. Each kit comes with a list of available alloys and its characteristics so you can determine the best alloy for your manufacturing process. (read more)

Indium Corporation - Indium Metal for Soldering and Sealing

No other metal is as versatile as indium metal. In its various forms it is used for:

  • Sealing in cryogenic applications - stays malleable and ductile below -150°C
  • Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C
  • High-end device cooling - reduces operating temperatures by up to 10°C
(read more)
Indium Corporation - Solder Research Kits for New Product Development

One of the key hurdles in new product development is being able to test a variety of options at a reasonable cost. Indium Corporation's Solder Research Kits provide you with the means to experiment with various solders. Kits available include: Solder Paste Solder Wire Solder Ribbon with fluxes that range from 102°C-350°C. (read more)

Indium Corporation - Indium Solder Paste...10.1 Pb-Free

Indium Corporation - 10.1 solder paste enables the lowest cost-of-ownership to PCB assembly manufacturers with an all-around balanced performance for both high print and soldering yields. (read more)

Indium Corporation - Electronics Assembly Solder Fortification Material

Indium Corp. -Having trouble getting consistently good strong solder joints? Improve first-pass yields - Reduce field failures - Improve performance - Enhance your company's reputation for on-time delivery, high quality and reliable performance.

SEE THE VIDEO WITH A SOLUTION (read more)

Indium Corporation - Eutectic AuSn Alloy for LED Die Attachment

Eric Bastow's presentation "A Comparison of Eutectic AuSn Alloy Delivery Options and Assembly Processes for LED Die-attachment", focuses on gold-tin alloys and their ability to meet the stringent requirements of current environmental legislation, as well as the challenges of assembling modern electronics devices. (read more)

Indium Corporation - Ball-Attach Flux

Indium Corporation - The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials. (read more)

News articles and press releases for Indium Corporation:

09/07/2017

A new solder paste specifically formulated to achieve ultra-low voiding in bottom termination component (BTC) assemblies and improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance.

04/25/2017

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the InnovationsFORUM Hungary on May 25 in Budapest, Hungary.

04/04/2017

Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon) April 29-May 4 in Providence, RI.

03/30/2017

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the 2017 Automotive Electronics Council (AEC) Annual Reliability Workshop April 18-20 in Novi, Mich.

03/29/2017

Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or 99.999%-pure.

03/21/2017

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16 in Nuremberg, Germany.

03/13/2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany.

03/13/2017

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany.

03/09/2017

Macartney is responsible for managing Indium Corporation’s global sales channel programs, including executing program strategies and developing tactical plans to enhance the sales channel program.

03/07/2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany.

03/07/2017

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany.

03/06/2017

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies 2017, March 28-30, in Penang, Malaysia.

02/28/2017

Indium Corporation has hired Tim Twining as the company’s new Vice President, Marketing. Twining is responsible for leading the development, implementation, and oversight of Indium Corporation’s market strategies.

02/16/2017

Indium Corporation will feature its precision gold alloy solder preforms at SPIE Defense + Commercial Sensing Expo, April 9-13, in Anaheim, Calif.

02/16/2017

Indium Corporation will feature its Ball-Attach Flux WS-575-C-RT at Productronica China from March 14-16, 2017, in Shanghai.

02/15/2017

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at the IPC APEX Expo technical conference on February 14-16 in San Diego, Calif.

02/15/2017

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March 5-8 in Phoenix, Ariz.

02/14/2017

Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.

02/13/2017

Seven Indium Corporation partners will exclusively run its low-voiding solder products “Live@APEX” throughout the IPC APEX Expo technical conference on Feb. 14-16 in San Diego, Calif.

02/09/2017

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen, Germany.

02/07/2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla.

02/02/2017

Indium Corporation will be running its low-voiding solder products “Live@APEX” in more than 20 partner booths throughout the IPC APEX Expo technical conference on Feb. 14-16 in San Diego, Calif.

01/31/2017

Indium Corporation has hired Seth Homer as Product Manager for Engineered Solders – IGBT. Homer will specialize in power electronics markets for engineered solders, automotive, renewable energy, industrial motor drives, consumer appliances.

01/17/2017

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead three sessions at the IPC APEX Expo technical conference on February 11-16 in San Diego, Calif.

01/10/2017

Indium's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Tim Jensen, Senior Product Manager for Engineered Solders Materials, will present at Pan Pacific Microelectronics Symposium 2017 in Kauai, Hawaii, Feb. 6-9, 2017.

01/03/2017

Indium Corporation’s Dr. Ning-Cheng Lee, VP of Technology, has been bestowed the prestigious title of Fellow of the Institute of Electrical & Electronics Engineers (IEEE) for his leadership in surface mount technology and interconnect materials.

12/15/2016

Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors.

12/13/2016

Indium Corporation's Dr. Ron Lasky, Senior Technologist, discusses the importance of indium tin oxide (ITO) in touchscreen and flat panel technology in a video available at www.indium.com/blog/phil-zarrow.

12/08/2016

Indium Corporation will feature halogen-free Indium8.9HF no-clean solder paste at NEPCON Japan 2017 Jan. 18-20 in Tokyo, Japan. Indium8.9HF specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

12/06/2016

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void™ at IPC APEX Expo on Feb. 11-16 in San Diego, Calif

11/30/2016

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

11/10/2016

Indium Corporation's Bill Jackson, Director and General Manager of Compounds, and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discuss the applications of indium.

11/03/2016

Indium Corporation announces that Jingya Huang has joined the company as Marketing Communications Assistant Manager.

10/17/2016

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will deliver a technical presentation at the IMAPS Autumn Conference on Oct. 20-21 in Munich, Germany.

10/14/2016

Indium Corporation’s Ivan Castellanos, Technical Services Manager, Latin America, recently hosted the highest-attended SMT Processes Certification course ever, with 34 attendees.

10/13/2016

Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill.

10/06/2016

Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, and Kenny Chiong, Senior Technical Support Engineer, will present at 2016 Electronics Packaging Technology Conference (EPTC) on Nov. 30-Dec. 3 in Suntec City, Singapore.

10/05/2016

Indium Corporation's newest informational video provides an overview of the versatility of indium when alloyed with other metals.

09/30/2016

Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).

09/28/2016

Several Indium Corporation experts will share their knowledge and expertise at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.

09/13/2016

Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 25-29 in Rosemont, Ill.

09/08/2016

Indium Corporation, the industry leader for void-reducing solutions, will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill.

09/01/2016

Indium Corporation’s Sze Pei Lim, Semiconductor Product Manager – Asia, will present at the 13th International Wafer-Level Packaging Conference (IWLPC 2016 – Bridging the Interconnect Gap), Oct. 18-20, in San Jose, Calif.

08/30/2016

Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia

08/18/2016

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.

08/09/2016

The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.

08/02/2016

Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.

07/14/2016

Indium Corporation's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials.

07/13/2016

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 Solder Paste to reduce voiding significantly below the industry average – for improved finished goods reliability

06/16/2016

Indium is used extensively in thermal management, low-temperature soldering, and sealing applications. In many instances, the indium is not fully consumed and can be reclaimed from the process.

06/02/2016

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, named to the International Microelectronics Assembly and Packaging Society (IMAPS) Global Business Council Steering Committee.

05/24/2016

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at (ECTC),

05/03/2016

Indium Corporation’s Eric Bastow, Assistant Technical Manager, has become one of only a handful of technologists to earn a re-certification of the Surface Mount Technology Association’s (SMTA) SMT Processes designation.

04/27/2016

Indium Corporation's germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream.

04/26/2016

Dr. Lee’s webtorial, Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications.

04/22/2016

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.

04/14/2016

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present Risk of No-Clean Flux Not Fully Dried Under Component Terminations at IPC Thailand on April 26 in Bangkok, Thailand.

04/12/2016

Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges.

03/29/2016

Hults works closely with other members of the Indium Corporation team to coordinate global resources that enhance relationships. He also develops and executes strategies that nurture existing accounts and encourage the growth of new business.

03/22/2016

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

03/17/2016

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.

03/15/2016

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corp. will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo on March 15-17 in Las Vegas.

03/15/2016

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo on March 15 in Las Vegas, Nev

03/10/2016

Indium Corporation will be running its low-voiding solder products “Live@APEX” in partner booths throughout IPC APEX Expo onMarch 15-17 in Las Vegas, Nev.

03/03/2016

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China.

03/02/2016

Indium Corporation announces the promotions of Sze Pei Lim to Regional Product Manager for Semiconductor Products in Asia and Jonas Sjoberg to Technical Manager for Asia.

03/01/2016

Indium Corporation’s Wolfgang Bloching, Regional Sales Manager – Germany, Austria, and Switzerland, will present at the EPP Innovations Forum on March 10 in Böblingen, Germany.

02/24/2016

Indium Corporation announces the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux helps engineers Avoid the Void™ by greatly improving visual inspection to minimize voiding and other defects in package-on-package applications.

02/18/2016

Indium Corporation will feature “Power-Safe” NC-SMQ®75, world’s first and only die-attach solder paste suitable for non-cleaned clip bond applications power semiconductor die-attach applications, SEMICON China March 15-17, 2016, in Shanghai, China.

02/17/2016

Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.

02/16/2016

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev.

02/11/2016

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

02/09/2016

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.

02/04/2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev.

01/05/2016

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

12/08/2015

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

12/01/2015

Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

11/16/2015

Traditional gallium trichloride is solid at room temperature and often forms clumps or sticks together during storage and use. This inhibits the efficient and consistent materials transfer between vessels and processing equipment.

11/06/2015

Vareha-Walsh brings extensive metals market experience from her previous roles, including Director of Global Procurement, Director of Metallurgical Procurement, Plant Controller, and Global Business Manager.

10/30/2015

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

10/28/2015

Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity and profitability

10/27/2015

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

10/22/2015

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.