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A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly
(Electrical, Optical, and Specialty Materials)
We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the...
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Achieving High-Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
(Electrical, Optical, and Specialty Materials)
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm®) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to...
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