Announcements

Palomar Technologies, Inc has promoted these products / services:

Palomar Technologies, Inc - Automated Epoxy Die Attach

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due to lower material and process costs. (read more)

Palomar Technologies, Inc - Lid Sealing vs Seam Sealing - Electronic Packages

While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how lid sealing compares to seam sealing. By understanding the technology and its typical uses and within the context of individual package designs, the ability to determine which method to select improves the likelihood of success. (read more)

Palomar Technologies, Inc - 25% Discount on SST 3130 w/Trade-In of DAP Furnace

Palomar Technologies announced that SST Vacuum Reflow Systems, a wholly-owned subsidiary of Palomar Technologies, is offering a 25% discount off the retail price of the SST 3130 programmable vacuum reflow oven with the trade-in of an SST DAP series furnace. (read more)

Palomar Technologies, Inc - Power Modules Fuel the EcoPower Revolution

Electric power stands at the center of the ecopower revolution, and at the center of the center stands the power module. Within this particular ecosystem, two principle types dominate power modules: the metal–oxide–semiconductor field-effect transistor or MOSFET power module and the insulated-gate bipolar transistor or IGBT power module. (read more)

Palomar Technologies, Inc - SST 8300 Series Automated Vacuum Pressure Soldering System

The SST 8300 Series is an automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure.  Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. (read more)

Palomar Technologies, Inc - 5100 Vacuum Pressure Furnace

The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. (read more)

Palomar Technologies, Inc - 3130 VACUUM PRESSURE FURNACE

The SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. (read more)

Palomar Technologies, Inc - 8000i Wire Bonder/Ball (Stud) Bumper

The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond performance. (read more)

Palomar Technologies, Inc - Palomar 3880 Die Bonder

Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable multiple die-type bonder on the market. (read more)

Palomar Technologies, Inc - Palomar 6500 Die Bonder

The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical applications. (read more)

Palomar Technologies, Inc - Palomar 9000 Wedge Bonder

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. (read more)

Palomar Technologies, Inc - SST 3190 High Vacuum Wafer Bonder

The SST 3190 and 3180 are high vacuum wafer bonders capable of wafer sizes to 6-inch (150 mm) diameter that provides precise automatic control of heating and cooling at temperatures up to 500°C (1000°C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. (read more)

Palomar Technologies, Inc - SST 3150 High Vacuum Furnace

The SST 3150 is a high vacuum furnace that provides advanced packaging capabilities in vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). The clean-room compatible system may also be configured to allow for in situ separation of lid and package, getter firing and sealing of MEMS packages. (read more)

News articles and press releases for Palomar Technologies, Inc:

04/22/2020

Customer demands increase for die attach and wire bonding equipment to manufacture 5G and respirator/ventilator components

02/14/2020

Palomar Technologies announced that to meet growing customer demand for its solutions around the world, it has moved to a new global headquarters and expanded its facilities to over 110,000 square feet.

01/14/2020

Palomar Technologies will exhibit its equipment and contract manufacturing/consulting solutions for the optoelectronic, laser and photonics markets, as well as present at Photonics West 2020 in San Francisco from February 4–6, 2020.