Announcements

Palomar Technologies, Inc has promoted these products / services:

Palomar Technologies, Inc - 3880-II Die Bonder Maximizes Productivity

The new Palomar 3880-II die bonder is based on Palomar’s proven 3880 die bonder design but now includes options to even further maximize productivity, reduce programming time by up to 95% and improve the overall bonder productivity. (read more)

Palomar Technologies, Inc - Manufacturing RF power amplifier assemblies

The production of RF power amplifiers necessitates both high volume and high quality. In general, finding a balance between maximizing throughput and meeting the required performance metrics, such as thermal conductivity of the bond between the die and package is crucial in any application, but is especially important in markets with growing demand. (read more)

Palomar Technologies, Inc - Join Palomar Technologies at ECOC in France

Join Palomar Technologies in Booth 317 from September 13 – 17 at the ECOC Exhibition in Bordeaux France. Learn about Palomar’s solutions for the photonics industry. (read more)

Palomar Technologies, Inc - WEBINAR: Journey to Full-scale Semiconductor Pkg

In this part 3 conclusion to the Journey to Full-scale Semiconductor Packaging webinar series, we will be covering the common challenges of mitigating risk when implementing changes in a mature process, how to efficiently make product revisions while maintaining production volume and how to reduce process disruptions caused by personnel. (read more)

Palomar Technologies, Inc - What’s the right packaging equipment for photonics

The photonics market is continuing to explode with a new report showing that just the European photonics market is growing at double the rate of global GDP – outperforming EU GDP and EU industrial production by three to five times, respectively*. (read more)

Palomar Technologies, Inc - Replace your 2460/6000/8000 with 8100 Wire Bonder

Replace your Palomar 2460/6000/8000 with the most technologically advanced fine wire ball bonder: the Palomar 8100 Wire Bonder.

For making interconnects between an integrated circuit (IC) and to other electronics or a PCB, there is nothing more cost-effective and flexible than using a fine wire ball bonder. (read more)

Palomar Technologies, Inc - Wire Bonding for RF and Microwave Devices

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area. (read more)

Palomar Technologies, Inc - High Reliability IR Microbolometers, IR Detectors

The construction of uncooled IR Microbolometers is based on the MEMS sensor with the specific number and size of the pixels to generate the thermal image. The SST 3150 creates high reliability MEMS packages. Packages are hermetically sealed with very low vacuum and moisture levels for extended, performance. The 3150 provides vacuum levels as low as 10-7 Torr, and temperatures to 500°C. (read more)

Palomar Technologies, Inc - Process Control for High Reliability Applications

WEBINAR: Process Control & Traceability for Military and High Reliability Semiconductor Applications

Automated packaging for aerospace and defense necessitates high reliability as the final assemblies will either need to function in the harshest environments or play critical roles where failure is not an option. (read more)

Palomar Technologies, Inc - WEBINAR: Solutions for Semiconductor Manufacturing

WEBINAR: The journey to full-scale semiconductor packaging: Part 2: Process Optimization Challenges of Semiconductor Manufacturing.

The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles. (read more)

Palomar Technologies, Inc - Automating Semiconductor Packaging & Assembly

The Palomar 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the 3880’s versatility includes both eutectic & epoxy die attach, flip chip, and a range of options. (read more)

Palomar Technologies, Inc - WEBINAR: Efficient Manufacture of IR sensors

With COVID-19, the growth of IR sensors used to measure heat as well as detect motion has exploded. IR imagers and detectors are used in a myriad of applications, from gas & fire detection to motion detection as well as temperature measurement, with the biggest growing market being smart buildings and people counting for retails. (read more)

Palomar Technologies, Inc - Process Control, Traceability, Automation for A&D

Join Palomar Technologies Product Marketing Manager, Kyle Schaefer for his presentation at the Components for Military and Space Electronics virtual exposition from April 19 – 22, 2021.

Kyle will present: The Necessity of Process Control, Traceability, and Automation in Manufacturing Aerospace and Defense Assemblies at 1:15pm PST on Tuesday, April 19. (read more)

Palomar Technologies, Inc - EV Engineering Conference: Power Module Failures

Join Palomar/SST Vacuum Reflow System at Charged Magazine EV Engineering Conference from April 19 – 22, 2021.

SST Vacuum Reflow Systems' Alex Voronel will present "Power Modules: Typical failure modes and how to solve them" at 11:15 am PST/2:15 pm EST on Wednesday, April 21. (read more)

Palomar Technologies, Inc - WEBINAR:Die Bonding Flexibility Next-Gen Photonics

Much of the semiconductor packaging industry is engaged in an exciting and growing photonics ecosystem. The associated challenges of photonics packaging, specifically relating to optical transceivers, include meeting anticipated performance gains while squeezing large package functionality into smaller, more thermally efficient footprints. (read more)

Palomar Technologies, Inc - Throughput/Process Control for RF Power Amplifiers

WEBINAR: Balancing Throughput and Process Control for Manufacturing of RF Power Amplifier Assemblies

The production of RF power amplifiers necessitates both high volume and high quality. Understanding the tools available to mitigate failures and protect against material inconsistencies is a necessary step in finding a balance between throughput and yield. In this webinar, we will... (read more)

WEBINAR: Power Modules: Typical failure modes and how to solve them.

Power Modules is a rapidly growing segment with high-growth applications ranging from electric vehicles, high-speed rail, and large medical devices. However, the stack of interconnects in power modules are the source of mechanical failures. (read more)

Palomar Technologies, Inc - Die Bonder Flexibility for Next Gen Photonics Pkg

Martyn Davies, New Business Development from Palomar Technologies UK, will present: "Die Bond Flexibility for Next Generation Photonic Packaging."

Meet Palomar Technologies at Photonics+ Virtual Conference and Exhibition on February 17 & 18th, 2021. PHOTONICS+ Virtual Exhibition and Conference, in partnership with EPIC, is the new digital live event for the photonics industry. (read more)

Palomar Technologies, Inc - The journey to full-scale semiconductor packaging

WEBINAR: The journey to full-scale semiconductor packaging: Part 1: Manufacturability Challenges of Semiconductor Packages for Start-ups

The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing... (read more)

Palomar Technologies, Inc - EPIC-UK Purchases Palomar 3880 Die Bonder

Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder. (read more)

Palomar Technologies, Inc - Palomar Technologies partners with Fraunhofer IISB

We work with research institutes around the world to contribute to the development and advancement of techniques and technologies. Our work results in new processes, products, or applications for customers. Palomar Technologies subsidiary, SST Vacuum Reflow Systems is working closely with the Fraunhofer Institute in the area of high-quality, void-free power module packaging for electric... (read more)

Palomar Technologies, Inc - Achieving <1% voiding in GaN die attach processing

The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with either eutectic solder or adhesive. SST Vacuum Reflow Systems, a Palomar solution published an article in Chip Scale Review which discusses the eutectic solder die attach where the preform is an alloy comprising a mixture of two or more dissimilar meta... (read more)

Palomar Technologies, Inc - Prototype to Production for Biophotonics & Medical

From Prototype to Production for Biophotonics & Medical Device Packaging Assembly

The medical device market is expected to significantly diversify and almost double in value to $90 billion by 2025, but vendors face significant cost and packaging challenges if they are to successfully exploit these opportunities. Learn more about the advanced development protocols drawn... (read more)

Palomar Technologies, Inc - High Accuracy Pattern Recognition for Die Bonding

When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die bonding systems require some type of vision processing for the machine to accurately locate the component before picking and placing the part. (read more)

Palomar Technologies, Inc - Flexibility for Semiconductor Prototyping

Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. Specifically, the interconnect methods can include conductive epoxy, solder paste, sintered paste, eutectic preforms, wire bonding, flip-chip with ball bumps, etc., which all require different technologies and equipment. (read more)

Palomar Technologies, Inc - Palomar 8100 Wire/Ball Bonder

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders. (read more)

Palomar Technologies, Inc - Join our Webinar:Taking Wire Bonding to New Levels

Join Palomar Technologies for our free webinar: Taking Wire Bonding to New Levels of Efficiency and Productivity (read more)

Palomar Technologies, Inc - Palomar Technologies New 8100 Wire Bonder

Palomar Technologies today announced the availability of their new Palomar 8100 Wire Bonder. The new 8100 wire bonder is a fully automated, thermosonic high-speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design, the Palomar 8100 incorporates the latest productivity technology and operator ergonomics. (read more)

Palomar Technologies, Inc - Automated Epoxy Die Attach

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due to lower material and process costs. (read more)

Palomar Technologies, Inc - Lid Sealing vs Seam Sealing - Electronic Packages

While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how lid sealing compares to seam sealing. By understanding the technology and its typical uses and within the context of individual package designs, the ability to determine which method to select improves the likelihood of success. (read more)

Palomar Technologies, Inc - 25% Discount on SST 3130 w/Trade-In of DAP Furnace

Palomar Technologies announced that SST Vacuum Reflow Systems, a wholly-owned subsidiary of Palomar Technologies, is offering a 25% discount off the retail price of the SST 3130 programmable vacuum reflow oven with the trade-in of an SST DAP series furnace. (read more)

Palomar Technologies, Inc - Power Modules Fuel the EcoPower Revolution

Electric power stands at the center of the ecopower revolution, and at the center of the center stands the power module. Within this particular ecosystem, two principle types dominate power modules: the metal–oxide–semiconductor field-effect transistor or MOSFET power module and the insulated-gate bipolar transistor or IGBT power module. (read more)

Palomar Technologies, Inc - SST 8300 Series Automated Vacuum Pressure Soldering System

The SST 8300 Series is an automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure.  Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. (read more)

Palomar Technologies, Inc - 5100 Vacuum Pressure Furnace

The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. (read more)

Palomar Technologies, Inc - 3130 VACUUM PRESSURE FURNACE

The SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. (read more)

Palomar Technologies, Inc - Palomar 3880 Die Bonder

Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable multiple die-type bonder on the market. (read more)

Palomar Technologies, Inc - Palomar 6500 Die Bonder

The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical applications. (read more)

Palomar Technologies, Inc - Palomar 9000 Wedge Bonder

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. (read more)

Palomar Technologies, Inc - SST 3190 High Vacuum Wafer Bonder

The SST 3190 and 3180 are high vacuum wafer bonders capable of wafer sizes to 6-inch (150 mm) diameter that provides precise automatic control of heating and cooling at temperatures up to 500°C (1000°C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. (read more)

Palomar Technologies, Inc - SST 3150 High Vacuum Furnace

The SST 3150 is a high vacuum furnace that provides advanced packaging capabilities in vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). The clean-room compatible system may also be configured to allow for in situ separation of lid and package, getter firing and sealing of MEMS packages. (read more)