Technical Articles

Indium Corporation has published these technical articles:

(Metals and Alloys)
From this Article:
Folks, Some years ago I received the request below: Hi Dr. Lasky, I am a precious metals recycler and would very much appreciate your verifying the validity of an equation that approximates the Karat...
(Electrical, Optical, and Specialty Materials)
From this Article:
During the 2011-2018 period, both production and demand quantities increased at an average CAGR of 3-5%, although production did not always increase in a straight line as it tends to anticipate or...
(Industrial Adhesives)
From this Article:
I recently spoke with Graham Wilson (Sr. Applications Engineer at Indium Corporation) about the advice he would give to customers looking to form the best possible seal using indium wire or indium...
(Welding Equipment and Supplies)
From this Article:
In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many of them completely wrong. In this paper,...
(Electrical Contact and Electrode Materials)
From this Article:
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting solder joint. This includes die-attach and even...
(Metals and Alloys)
From this Article:
One of questions I am commonly asked involves the long-standing issue of, "What do we mean by clean?" A lot of research has been done to try to define "clean," usually using some measure of the level...
(Electrical, Optical, and Specialty Materials)
From this Article:
This study will review several cases where changing the stencil design or reflow profile dialed in the variation of comparative results. The same typical, commercially available test vehicle was used...
(Electrical, Optical, and Specialty Materials)
From this Article:
As the electronics industry moves toward miniaturization and multifunction, smaller components with more functions, such as quad-flat no-leads (QFNs) and LGAs, are increasingly used in a variety of...
(Electrical, Optical, and Specialty Materials)
From this Article:
Bottom terminated components (BTCs) are one of the most important components in electronics today. Their combination of small size, excellent electrical performance, and ability to transfer heat away...
(Metals and Alloys)
From this Article:
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to...
(Industrial Adhesives)
From this Article:
Die-attach for high power devices, such as IGBT, is facing increasing challenges of service temperature, thermal conductivity, electrical conductivity, and reliability. Conventional high-lead solder...
(Metals and Alloys)
From this Article:
The explosive growth of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive electrical components. Not too...
(Electrical, Optical, and Specialty Materials)
From this Article:
Voiding under QFNs is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips....
(Metals and Alloys)
From this Article:
Voiding is a key concern for components with thermal planes because interruptions in the Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder...