Technical Articles

Indium Corporation has published these technical articles:

(Metals and Alloys)
From this Article:
Folks, Some years ago I received the request below: Hi Dr. Lasky, I am a precious metals recycler and would very much appreciate your verifying the validity of an equation that approximates the Karat...
(Electrical, Optical, and Specialty Materials)
From this Article:
We will demonstrate how the NanoBond® process can be used to control stresses during the bonding and deposition processes. Modeling will be conducted to compare standard bonding processes to the...
(Electrical, Optical, and Specialty Materials)
From this Article:
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm®) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to...
(Electrical, Optical, and Specialty Materials)
From this Article:
A novel nano-Ag sintering paste C has been developed for a pressureless sintering process under air....
(Electrical, Optical, and Specialty Materials)
From this Article:
This paper will cover the design and assembly techniques for using of solder performs in the Solder Fortification® needs described above. Several successful applications will be presented. In...
(Electrical, Optical, and Specialty Materials)
From this Article:
During the 2011-2018 period, both production and demand quantities increased at an average CAGR of 3-5%, although production did not always increase in a straight line as it tends to anticipate or...
(Industrial Adhesives)
From this Article:
I recently spoke with Graham Wilson (Sr. Applications Engineer at Indium Corporation) about the advice he would give to customers looking to form the best possible seal using indium wire or indium...
(Electrical, Optical, and Specialty Materials)
From this Article:
In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering....
(Electrical, Optical, and Specialty Materials)
From this Article:
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria....
(Electrical Contact and Electrode Materials)
From this Article:
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting solder joint. This includes die-attach and even...
(Electrical, Optical, and Specialty Materials)
From this Article:
Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives...
(Metals and Alloys)
From this Article:
One of questions I am commonly asked involves the long-standing issue of, "What do we mean by clean?" A lot of research has been done to try to define "clean," usually using some measure of the level...
(Electrical, Optical, and Specialty Materials)
From this Article:
This study will review several cases where changing the stencil design or reflow profile dialed in the variation of comparative results....
(Electrical, Optical, and Specialty Materials)
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This paper uses a series of experiments, including optimization of stencil apertures and reflow thermal profiles, and the use of solder performs, to attempt to find solutions to voiding issues....
(Electrical, Optical, and Specialty Materials)
From this Article:
This paper discusses: The casting of these low-melting alloy sputtering targets, and the subsequent bonding of the alloys to a backing plate for use in existing equipment. In addition, the...
(Electrical, Optical, and Specialty Materials)
From this Article:
As a result of the voiding concern, we and our colleagues have performed a thorough analysis and experimental plan to minimize voiding in QFN assembly. Our experimental plan covers many process and...
(Electrical, Optical, and Specialty Materials)
From this Article:
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to...
(Electrical, Optical, and Specialty Materials)
From this Article:
Thermal aging time has a negligible effect on porosity, presumably due to balanced stress between tension and sintering shrinkage. The maximum service temperature of the Ag sintered joint is about...
(Electrical, Optical, and Specialty Materials)
From this Article:
The explosive growth of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive electrical components. Not too...
(Electrical, Optical, and Specialty Materials)
From this Article:
Moore's Law, the driving force and sine qua non of the semiconductor industry for the last sixty years, is beginning to slow due to both physical and economic limitations....
(Electrical, Optical, and Specialty Materials)
From this Article:
Voiding under QFNs is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips....
(Electrical, Optical, and Specialty Materials)
From this Article:
Quad-flat no-leads (QFN) package designs are receiving more and more attention in the electronics industry. This package offers a number of benefits including (1) small size, such as a near die size...
(Metals and Alloys)
From this Article:
Voiding is a key concern for components with thermal planes because interruptions in the Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder...