Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The...

The reliability of Plated through holes (PTH's) is presented as "PTH life curves" which plot cycle to fail vs. temperature for the entire range of field, accelerated thermal cycling, and assembly...

Electronic Packaging is a critical part of all electronic devices and can be a source of the reliability problems experienced by systems using those devices. In many cases, the packaging defects are...

The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D...