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About

Endicott Interconnect Technologies, Inc.

 

 

 

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration.

EI product lines meet the needs of markets including IT, telecommunications, aerospace and defense, advanced test equipment, medical and power management, where highly reliable products built in robust manufacturing operations are critical for success.

With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation.



Endicott Interconnect Technologies, Inc.

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Technical Articles

Large Thin Organic PTFE Substrates for Multichip Applications (Desktop Personal Computers) Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The... (View Full Article)
Proof is in the PTH -- Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards (Desktop Personal Computers) The reliability of Plated through holes (PTH's) is presented as "PTH life curves" which plot cycle to fail vs. temperature for the entire range of field, accelerated thermal cycling, and assembly... (View Full Article)