This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages....

Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or...

The rework process has long consisted of three steps: removal of the inoperative component, cleaning of residual solder from the ball grid assembly (BGA) pads which held the component in place, and...

Why has robotic soldering become a more popular option in a wide range of applications? For the same reasons that manufacturing facilities always embrace automated processes â€" improved consistency,...