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Our advanced thermal pad is specifically designed for automated production lines. It features precision die-cutting that ensures perfect dimensional consistency for robotic placement systems. The anti-static formulation prevents dust attraction and component damage during automated handling.
The material''s optimized tackiness allows reliable robotic placement while preventing displacement during assembly. This results in higher production yields and reduced downtime. The pad delivers excellent thermal performance for cooling processors and power management ICs.
Its silicone-based formulation ensures long-term stability under demanding conditions. This solution helps manufacturers achieve higher automation efficiency while maintaining reliable thermal management in electronic devices.
In AI and HPC, thermal throttling is the enemy of progress. GPUs demand next-generation cooling. Our advanced thermal gel is engineered for this, mastering the complex topography of high-power processors. It flows effortlessly to fill large gaps over capacitors and conforms to microscopic imperfections on dies, creating a perfect thermal bridge that efficiently channels heat away to prevent throttling and sustain peak compute performance.
Its reliable, non-pump-out formula ensures stability through relentless power cycles, while simplifying high-volume server assembly. This is the new standard in thermal management for data centers and labs pushing the limits of AI.
Our specialized thermal grease delivers critical cooling performance for electric vehicle power modules. Designed to withstand harsh automotive environments, it maintains optimal thermal conductivity during intense temperature cycles. The formulation resists pump-out and degradation, ensuring consistent heat transfer from IGBT and SiC modules to cooling systems.
This reliability extends component lifespan while maintaining peak efficiency in EV power electronics. By preventing overheating issues, our grease supports the demanding requirements of modern electric vehicles, helping engineers create more durable and efficient transportation solutions. The product''s stable performance under extreme conditions makes it an essential choice for automotive power management systems.
Our thermal tape combines thermal conductivity and adhesive strength in one solution. It efficiently transfers heat while providing secure component bonding, eliminating need for separate thermal pads and mechanical fasteners. Ideal for smartphones, LEDs, and automotive electronics where space is limited.
This tape simplifies assembly processes, reduces weight, and improves reliability through consistent thermal performance. Its electrical insulation properties and durability under thermal cycling make it perfect for modern compact designs. The material enables design flexibility while maintaining effective heat dissipation from critical components.
Engineers can achieve better thermal management with easier installation and reduced overall thickness. Discover how this dual-function tape enhances electronics cooling and bonding in space-constrained applications across multiple industries.
AI servers need robust cooling for heavy workloads. Our conductive pads efficiently transfer heat from processors/GPUs to heatsinks.Advanced silicone resists drying and pump-out effects, ensuring consistent high-temperature performance. Precise thickness guarantees optimal contact.Standard/cus
Modern electronics need thermal solutions balancing performance and protection. Our advanced thermal pads enable superior heat transfer while safeguarding sensitive components via optimized material engineering. Their silicone matrix delivers efficient conductivity without sacrificing gentle mechanical properties, ideal for high-performance computing, automotive systems, and precision electronics.Outperfo
Our silicon-free thermal pad delivers advanced heat dissipation in a compact and efficient design. Its ultra-thin structure ensures seamless integration into tight spaces, making it ideal for high-performance applications such as CPUs, GPUs, and LED systems. By eliminating silicone oil, this thermal pad provides a clean and maintenance-free solution compared to traditional thermal pastes. The material remains stable over time, resisting drying or cracking while maintaining consistent thermal conductivity. Engineered for durability and performance, it is a preferred choice for tech enthusiasts, engineers, and manufacturers seeking an eco-friendly and reliable cooling solution. Optimize your device''s thermal management with a pad that combines efficiency, flexibility, and long-term reliability.
Sheen's thermal adhesives provide superior CPU cooling with permanent structural bonding and 5W/mK thermal conductivity. Unlike conventional pastes, our solution eliminates pump-out effect while maintaining efficient heat transfer under continuous high loads. The electrically insulating adhesive fills microscopic imperfections for optimal CPU-heatsink contact, with precise viscosity control ensuring consistent bond line thickness. Withstanding temperatures up to 200°C, it delivers reliable long-term performance for demanding computing applications. Available in multiple formulations, our adhesives meet international quality standards. As a leading Chinese manufacturer, Sheen combines material innovation with rigorous production to offer dependable thermal solutions for consumer electronics, servers, and industrial systems. Our technical team provides expert application support.