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IRISO U.S.A., Inc.

Pin header technology will never be the same! Look at IRISO's new Z-Move™ 18008 Series. This bottom entry floating socket offers misalignment correction, vibration protection while reducing stress to soldering joints and contact area (providing a more reliable connection). Read more...

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IRISO U.S.A., Inc.

14001 Series is USB Type-C™ board-mount receptacle which meets USB 3.1(Gen2) electrical specification, 10Gbps/100W. Read more...

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IRISO U.S.A., Inc.

18010S is high speed signal interface MXM connector compatible with Qseven specification. It can be used to connect the carrier board interface to carry all I/O signals to and from Qseven® module. Read more...

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IRISO U.S.A., Inc.

9663/9664/9665 series are 1.0mm-pitch SMT FPC/FFC connector. IRISO original "I-Lock" design prevents FPC/FFC card dropout and makes good tactile while insertion to improve operation efficiency.
Also it has temporary FPC card holding mechanism to prevent mis-insertion of FPC. Many Connection Types and Contact Structures are available. Read more...

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Keystone Electronics Corp.

A new assortment of durable Nylon card guides used to mount circuit boards are among the latest circuit board mounting devices available from Keystone Electronics Corp Read more...

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Interplex Industries, Inc.

Learn about Interplex's solder and flux bearing lead technology (SBL), a technology that has been deployed across a wide spectrum of product designs and applications. Virtually any arena that requires the joining of metal parts via solder is a candidate application for integrating the solder within one of the components. Read more...

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IRISO U.S.A., Inc.

12001 series is 0.5mm pitch SMT, right angle(bottom contact) type FPC/FFC Connector. IRISO's Original "I-Lock" design, 0.5mm pitch FPC/FFC, Tandem Contact, Flip Type Connector. Read more...

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IRISO U.S.A., Inc.

11600S series is vertical mount type FFC/FPC connector which has high speed signal transmission capability. Read more...

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Interplex Industries, Inc.

This Interplex Press-Fit Tech Bulletin discusses the current carrying capacity, especially in high-power applications.

The specific three topics in this series are:

• Application requirements for higher current capabilities

• Current capability testing and results

• Special design considerations for power module applications. Read more...

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