Keystone Electronics Corp.

New snap action “Key-Pad” dome contacts from Keystone specifically designed as a momentary contact for PCB’s, flex circuits, membrane/discrete switches. Unique 4-legged shape offer enhanced durability, reliability, versatility while maintaining exceptional tactile feel. Nickel-plated stainless steel manufacture, domes are built for harsh environments requiring substanti... Read more...

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Bead Electronics

With great variance in automotive design, Bead Electronics can make any custom pin you may need in a fast, more cost efficient manner. Read more...

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PHOENIX CONTACT USA

‘Cabinet Confidence’ Infomobile

Phoenix Contact vehicle shows how products work together to maximize efficiency

The newest edition of Phoenix Contact’s Infomobile has hit the road. The vehicle features a “Cabinet Confidence” theme, demonstrating how Phoenix Contact products work together to provide cost-effective, flexible soluti... Read more...

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Advanced Technical Ceramics Company

Advanced Technical Ceramics Company manufactures custom IC interconnect components to match your specifications. Read more...

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Advanced Interconnections Corp.

Advanced Interconnections' Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Read more...

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Rego Electronics Inc.

SIM cards store network-specific information. They are used to authenticate and identify subscribers on the network. There are four different formats: full-size SIMs, mini-SIMs, micro-SIMs, and nano-SIMs. We include full-size SIM sockets, mini-SIM sockets and micro-SIM sockets, ejection mechanism push-push types, hinge types and push-pull types available for customer's design selection. Read more...

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Keystone Electronics Corp.

Keystone Electronics Corp. offers UL recognized, male and female PCB quick-fit terminals and rivet mount male quick-fit terminals designed to hold up under repeated mating cycles. Read more...

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Advanced Interconnections Corp.

Surface mount sockets from Advanced are available in footprints from 0.50mm to 1.27mm pitch. Sockets feature industry-proven solder ball terminals in either eutectic Tin/Lead or RoHS Compliant lead-free Tin/Silver/Copper. More Information... Read more...

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Advanced Interconnections Corp.

The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. More Information... Read more...

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Advanced Interconnections Corp.

Unique solder perform terminals from Advanced Interconnections Corp. (Advanced) reduce assembly costs by eliminating time-consuming steps in PC board processing. Read more...

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