Advanced Technical Ceramics Company manufactures custom IC interconnect components to match your specifications. Read more...More Product Announcements from Advanced Technical Ceramics Company
Advanced Interconnections' Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Read more...More Product Announcements from Advanced Interconnections Corp.
SIM cards store network-specific information. They are used to authenticate and identify subscribers on the network. There are four different formats: full-size SIMs, mini-SIMs, micro-SIMs, and nano-SIMs. We include full-size SIM sockets, mini-SIM sockets and micro-SIM sockets, ejection mechanism push-push types, hinge types and push-pull types available for customer's design selection. Read more...More Product Announcements from Rego Electronics Inc.
Keystone Electronics Corp. offers UL recognized, male and female PCB quick-fit terminals and rivet mount male quick-fit terminals designed to hold up under repeated mating cycles. Read more...More Product Announcements from Keystone Electronics Corp.
Surface mount sockets from Advanced are available in footprints from 0.50mm to 1.27mm pitch. Sockets feature industry-proven solder ball terminals in either eutectic Tin/Lead or RoHS Compliant lead-free Tin/Silver/Copper. More Information... Read more...More Product Announcements from Advanced Interconnections Corp.
The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. More Information... Read more...More Product Announcements from Advanced Interconnections Corp.
Unique solder perform terminals from Advanced Interconnections Corp. (Advanced) reduce assembly costs by eliminating time-consuming steps in PC board processing. Read more...More Product Announcements from Advanced Interconnections Corp.
Thin film substrate qualities matched with Multilayer High Temperature Co-Fired Ceramic (HTCC) structures for use with flip chip, copper metallization and cavities. Read more...More Product Announcements from Advanced Technical Ceramics Company
An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. Read more...More Product Announcements from Advanced Interconnections Corp.
Wire-bondable plating is a key process step in the manufacturing of all types of semiconductor packages including Integrated Connector Package Modules such as MEMS housings, sensors, LEDs, and Solar and Power Electronic modules. Successful bonding of aluminum or gold wire to an interconnect module lead-frame requires a plated surface with the highest level of material surface quality. Read more...More Product Announcements from Interplex Industries, Inc.