Si3N4 Ceramic Parts 1200°C High Strength

Featured Product from Fountyl Technologies Pte. Ltd.

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Product Overview

Used in semiconductor processing chambers and high-temperature industrial equipment where mechanical strength must be retained above 1000 C. Fountyl silicon nitride (Si3N4) ceramic parts are sintered to full density with flexural strength exceeding 800 MPa at room temperature and remaining above 600 MPa at 1200 C. The material combines high fracture toughness (6-7 MPa.m1/2) with excellent thermal shock resistance, low thermal expansion (3 ppm/C), and good electrical insulation.

Si3N4 is the preferred ceramic for applications requiring both high-temperature stability and mechanical reliability under thermal cycling. Standard and custom geometries include plates, rings, pins, tubes, and complex near-net shapes.

Material Specifications

- Flexural strength (room temperature): >= 800 MPa
- Flexural strength (1200 C): >= 600 MPa
- Fracture toughness: 6-7 MPa.m1/2
- Vickers hardness: >= 1500 HV
- Thermal expansion: 3 ppm/C (room temperature to 1000 C)
- Thermal conductivity: 25-35 W/m.K
- Maximum service temperature: 1400 C (inert atmosphere)
- Density: 3.2-3.3 g/cm3
- Electrical resistivity: > 10^14 ohm.cm (room temperature)

Key Features

- High-temperature strength -- flexural strength >= 600 MPa at 1200 C. Outperforms alumina and most other structural ceramics at elevated temperatures.
- Thermal shock resistance -- low thermal expansion (3 ppm/C) and high thermal conductivity enable rapid temperature changes without cracking.
- Fracture toughness -- 6-7 MPa.m1/2 provides resistance to chipping and crack propagation, improving reliability during handling and installation.
- Wear resistance -- hardness >= 1500 HV and self-lubricating surface properties reduce friction in sliding contact applications.
- Electrical insulation -- resistivity > 10^14 ohm.cm makes Si3N4 suitable for RF window and insulator components in plasma chambers.
- Chemical stability -- resistant to molten non-ferrous metals and most process chemicals. No outgassing in vacuum environments.

Applications

- Semiconductor etch chamber components -- focus rings, edge rings, coupling windows, and nozzle inserts
- CVD and epitaxy process kits -- susceptors, pedestal covers, and lift pin guides
- Plasma etcher insulators and RF windows -- electrical insulation combined with plasma resistance
- High-temperature jigs and fixtures -- furnace tooling, brazing fixtures, and molten metal handling
- Bearing and mechanical seal components -- wear-resistant rolling elements and seal faces

Manufacturing Capability

In-house production through powder processing, sintering, precision grinding, and final inspection. Standard and custom geometries available. Material property test data provided with each production lot.