Advanced porous ceramic vacuum chucks featuring sub-micron flatness and uniform airflow distribution, engineered to eliminate wafer deformation and minimize TTV during 300mm semiconductor backgrinding and inspection. (read more)

Advanced ceramic solutions provide outstanding stability, cleanliness, and durability in demanding semiconductor environments, helping improve process consistency, equipment performance, and manufacturing efficiency. (read more)

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. (read more)

High-strength, lightweight ceramic beams for ultra-precision motion platforms and semiconductor inspection equipment. (read more)

Ultra-precision silicon carbide (SiC) ceramic guide rails for semiconductor lithography systems. Designed for nanometer-level motion accuracy under high-speed operation. (read more)

Porous ceramic chuck features uniform permeability, high strength, and excellent thermal resistance, ideal for semiconductor wafer grinding and precision processing applications. (read more)

Alumina and silicon carbide ceramic end effectors for precision wafer transfer in semiconductor equipment. Lightweight, high stiffness, low particle generation. Precision fork geometry with custom edge grip and vacuum ports for 150-300mm wafer handling. (read more)

High-precision ceramic pistons with 3 um cylinder clearance for chemical metering pumps and precision fluid handling. Alumina and silicon carbide options. Wear-resistant, chemically inert, no seals required. Diameter 5-50mm, length up to 200mm. (read more)

High-stiffness silicon carbide beams for precision metrology frames, wafer inspection stages, and optical systems. Elastic modulus 420 GPa, density 3.1 g/cm3, thermal expansion 4 ppm/C. Rectangular, I-beam, and hollow profiles up to 1000mm. (read more)

High-density, customizable electrostatic chuck ensures stable wafer clamping, precise temperature control, and compatibility with various semiconductor materials. (read more)

Silicon carbide (SiC) ceramic beams are engineered for ultra-precision motion platforms and inspection equipment, providing high stability, low inertia, and reliable performance in advanced manufacturing environments. (read more)

High-precision alumina ceramic end effector designed for semiconductor wafer handling, featuring excellent wear, corrosion, and high-temperature resistance to ensure stable and efficient automation. (read more)

Featuring 2–3 μm precision clearance, superior wear resistance, and chemical stability, precision ceramic pistons enable reliable fluid metering in new energy battery, medical, food, semiconductor, and precision fluid applications. (read more)

Fountyl silicon carbide (SiC) precision components offer high strength, chemical resistance, and thermal stability, specifically designed for photolithography machines and integrated circuit manufacturing equipment, ensuring ultra-precision and long-term reliability. (read more)

High-precision wafer pin silicon carbide chuck designed for semiconductor manufacturing, offering strong adsorption, excellent stability, and resistance to high temperature, corrosion, and wear. Ideal for wafer clamping and prealigner applications. (read more)

Microporous ceramic chuck ensures precise wafer handling with uniform adsorption, high strength, and chemical resistance. (read more)

Durable Al₂O₃ alumina ceramics with excellent plasma corrosion resistance, high wear resistance, ideal for semiconductor equipment, guide rails, and industrial structural parts. (read more)

AlSiC combines lightweight design, high strength, and thermal stability, ideal for aerospace, automotive, electronics, and precision instruments demanding reliable performance. (read more)

Advanced semiconductor electrostatic chucks (ESCs) featuring high-purity ceramic materials, multi-zone temperature control, and superior wafer clamping force to maximize yield in etching, CVD, and PVD processes. (read more)

Fountyl ceramic piston with 2–3µm rod-to-sleeve clearance delivers wear resistance, chemical stability, and precise fluid control for battery, medical, and micro-dispensing applications. (read more)

A lightweight, high-strength aluminum silicon carbide composite engineered for thermal stability and heat dissipation—ideal for aerospace, EVs, power electronics, and precision optical systems. (read more)

High-precision ceramic chuck with precision-machined ring groove patterns for wafer clamping and backside gas cooling. Available in alumina and silicon carbide. Compatible with 150-300mm wafer etch, CVD, and PVD chambers. (read more)

Silicon nitride (Si3N4) ceramic parts with flexural strength maintained up to 1200 C. High fracture toughness, thermal shock resistance, and electrical insulation. Used in semiconductor etch chambers, CVD systems, and high-temperature industrial equipment. (read more)

Alumina and silicon carbide ceramic end effectors for semiconductor wafer handling in cleanroom and vacuum environments. Lightweight, high stiffness, wear-resistant surface. Compatible with 150-300mm wafer transfer robots. No outgassing, no particle generation. (read more)

Air bearing positioning tables with zero friction, no wear, and sub-micron accuracy. Used in wafer inspection, precision metrology, and laser processing. Travel range up to 1200mm per axis, load capacity up to 100 kg. (read more)

High-precision SiC pre-aligner chucks feature excellent thermal stability and chemical resistance, making them ideal for wafer clamping, inspection, and handling applications in semiconductor manufacturing. (read more)

Designed for next-generation manufacturing, this high-purity component delivers non-destructive wafer holding via uniform micro-pores. It ensures excellent flatness during high-vacuum processing while preventing contamination. By maintaining sub-micron coplanarity, it directly enhances production yields in lithography and inspection. (read more)

Advanced alumina ceramic guide rails designed with exceptional hardness, sub-micron dimensional stability, and zero-particle wear resistance, engineered to replace conventional metal rails in high-vacuum, cleanroom semiconductor and automation transport equipment. (read more)

Aluminum silicon carbide (AlSiC) components provide lightweight structural strength, high thermal conductivity, and dimensional stability for aerospace, electronics, and EV systems. (read more)

High-purity quartz components engineered for semiconductor, optics, optical communication, photovoltaic, and LED industries, offering superior thermal stability, chemical resistance, and electrical insulation for demanding high-temperature and high-precision applications. (read more)

Alumina ceramics offer excellent plasma corrosion resistance and high wear resistance, making them ideal for semiconductor equipment and other industrial uses. (read more)

This porous air floating platform offers zero friction, smooth operation, and high motion accuracy, providing a non-contact solution for load transfer in semiconductor and glass substrate applications. (read more)

Quartz structural parts provide high thermal stability, chemical resistance, and dimensional precision, enabling reliable performance in semiconductor, optical, photovoltaic, and high-temperature industrial applications. (read more)

High-strength, durable porous ceramics with superior chemical stability and versatile industrial applications. (read more)

High-precision ceramic guide rails manufactured from alumina and silicon carbide, offering high stiffness, low thermal expansion, excellent wear resistance, and stable motion performance for semiconductor and precision automation equipment. (read more)

High-purity SiC wafer pins and chucks for semiconductor equipment, providing plasma resistance, thermal stability, precision wafer support, and low particle generation. (read more)

A precision ceramic ring groove chuck designed for semiconductor wafer handling applications. It provides stable wafer support, excellent flatness, low particle generation, and reliable performance in cleanroom environments. (read more)

Advanced ceramic structural parts with high temperature resistance, wear resistance, and excellent insulation for industrial and aerospace applications. (read more)

Lightweight, high-stiffness aluminum silicon carbide (AISiC) structural and thermal parts for aviation, aerospace, marine, rail, and new energy vehicle applications. Combines metal and ceramic advantages while avoiding single-material limitations. (read more)

Ultra-pure quartz glass with exceptional thermal, chemical, and optical properties—ideal for semiconductor, aerospace, and high-precision optical applications. (read more)

Zirconia ceramics offer superior mechanical strength, wear and heat resistance for demanding industrial components. (read more)

Alumina ceramic end effectors. Lightweight, high stiffness, wear-resistant. Thin-profile design reduces particle generation during wafer transfer. Compatible with 150–300mm wafer handling robots. (read more)

Porous ceramic chucks with uniform gas permeation for non-contact wafer transport and vacuum clamping in semiconductor lithography, inspection, and metrology equipment. (read more)

Porous air floating platform with non-contact load transfer technology, offering zero friction, silent operation, and high precision for semiconductor and glass substrate handling. (read more)

High-performance ceramic components, including SiC, Al₂O₃, AlN, and Si₃N₄, engineered for semiconductor equipment with superior strength, corrosion resistance, and precision processing. (read more)

Designed for semiconductor manufacturing, these alumina ceramic end effectors deliver high-precision wafer handling. They offer exceptional wear resistance, corrosion stability, and a lightweight design to reduce robot load while ensuring stable, efficient automation in high-temperature or harsh environments. (read more)

This porous ceramic chuck is engineered for uniform suction and damage-free holding, providing micron-level flatness and cross-contamination prevention in high-precision semiconductor manufacturing. (read more)

High-purity silicon carbide chucks feature sub-micron flatness, excellent thermal conductivity, and outstanding wear resistance, making them suitable for wafer handling in next-generation lithography, etching, deposition, and metrology systems. (read more)