Silicon Carbide Wafer Pin Chuck

Featured Product from Fountyl Technologies Pte. Ltd.

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Product Overview

Used in plasma etch chambers, CVD systems, and ion implantation equipment for wafer clamping and lift-pin support during processing. Fountyl silicon carbide wafer pin chucks integrate the clamping surface and lift pins into a single high-purity sintered SiC (>= 99%) assembly. The material delivers density >= 3.10 g/cm3, flexural strength >= 450 MPa, Vickers hardness >= 2500 HV, and thermal conductivity >= 150 W/m.K. Maximum service temperature 1600 C in inert atmosphere. Semi-insulating grade (10^4-10^6 ohm/sq) available for ion implantation applications.

Material Specifications

- Material: High-purity sintered silicon carbide (SiC >= 99%)
- Density: >= 3.10 g/cm3
- Flexural strength: >= 450 MPa
- Vickers hardness: >= 2500 HV
- Thermal conductivity: >= 150 W/m.K (room temperature)
- Max service temperature: 1600 C (inert atmosphere)
- Surface resistivity: 10^4-10^6 ohm/sq (semi-insulating grade)

Key Features

- Plasma erosion resistance -- withstands fluorine and chlorine chemistry without coating. Low erosion rate extends PM cycles.
- Thermal stability -- no outgassing, no metal contamination. Holds dimensional accuracy at temperatures up to 800 C.
- Hard surface -- >= 2500 HV minimizes particle generation from wafer contact across millions of cycles.
- Integrated pin-and-chuck design -- eliminates alignment errors between separate pin and chuck components.
- Semi-insulating option -- dissipates charge buildup during ion implantation to reduce wafer ESD risk.
- Precision fit -- pin guide clearance 0.01-0.03mm for consistent wafer positioning.

Applications

- Plasma etch chambers -- wafer clamping and lift-pin support for oxide, metal, and poly-Si etching.
- CVD and PECVD systems -- wafer support at deposition temperatures up to 800 C.
- Ion implantation -- semi-insulating SiC grade charges dissipate charge accumulation and protect wafers from electrostatic discharge.

Manufacturing Capability

In-house production from powder processing through sintering, precision grinding, and final cleaning. Custom pin layout, chuck diameter, and vacuum hole patterns available for specific chamber designs.