Material Advantages:
Aluminum silicon carbide (AISiC) combines the best of aluminum alloys and ceramic materials, delivering:

• High specific stiffness & strength
• Excellent dimensional stability
• Low thermal expansion coefficient
• High wear and corrosion resistance
• Good wave absorption and thermal conductivity

Applications & Benefits:

1. Structural Parts:
• High-precision, lightweight, wear-resistant, and corrosion-resistant components.
• Suitable as alternatives to aluminum alloy, titanium alloy, and stainless steel in high-precision, high-stiffness parts with counterweight requirements.
• Supports complex, thin-wall structures, small precision holes, and whorls.
2. Heat Dissipation Parts:
• Microelectronic cooling substrates and IGBT package base plates.
• High thermal conductivity and low thermal expansion reduce circuit cracking and extend product life.
• Ideal for electronics, high-speed rail, new energy vehicles, radar, and wind power applications.

Performance Comparison Highlights:

• Density: 2.8–3.2 g/cm³
• Thermal conductivity: 163–255 W/m·K
• Coefficient of thermal expansion: 4.5–16 ×10??/°C
• Specific stiffness: 76–108 GPa·cm³/g

Why Choose AISiC:

• Lightweight yet strong and stiff
• Excellent thermal and dimensional stability under high/low temperature cycles
• Improved machinability over traditional metal-ceramic composites
• Broad applications across aviation, aerospace, rail, marine, and new energy vehicles