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Extremely compressible thermal interface materials

Featured Product from Fujipoly® America Corp.

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SARCON® PG65A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible.

This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also helps reduce stress on the PCB during assembly.

-Thermal conductivity of 6.5 W/m°K.
-Thicknesses from 0.3mm to 2mm
-Improves cooling performance by completely filling small and unwanted air gaps
-Available in precut dimensions up to 300mm x 200mm
-Can be die-cut to fit almost any application shape.