In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB. Presented by Christian Miraglia, Applications Engineering Manager

Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials. Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers

With this sample box, you can test the performance properties of multiple materials to find the perfect option for your specific application. Request yours today, visit: https://www.fujipoly.com/usa/

About Fujipoly

Fuji Polymer Industries was established by a joint capital venture between Dow Corning and Chugai Bussan in 1978 as a company that would specialize in the secondary processing of industrial silicone rubber.

Fujipoly has steadily grown over the past 21 years and now has nine divisions located in North America, Europe and Asia. In addition to the nine locations, Fujipoly has a network of distributors and representatives, throughout the world, to meet your needs at the local level.

This borderless business strategy has allowed Fujipoly to offer our products and support at locations, and at times, that are convenient to our customers.

In the manufacturing industry where technological innovations are taking place one after the other, Fujipoly has always devoted itself to developing and supplying only those products that would meet the needs of the time.

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A variety of specific compounds are available for a wide range of performance requirements in Sheets, Rolls, Die-Cuts, Sleeves, Gel, Extrusions and Moldings. Contact Fujipoly for more information: info@fujipoly.com

Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities ​The basic Gap Filler Pad series can be further enhanced for special handling and die-cutting requirements This product has a lower specific gravity and less oil bleeding than our conventional products *only applicable for GR14B

-Fill large gaps while providing superior thermal transfer ​-Comfortable with the very low compression forces -Excellent vibration absorption capabilities -Maintains all initial properties across a wide range -Used to "Form in Place" and remain form stable -Requires no heat curing -Will not cause corrosion on any metal surface

-Highly Thermally Conductive and Non-Flammable Interface materials -Surface consistency is excellent for dilling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of components -Very low compression force at high compression rate PG25A, PG45A: Very low modulus​

Fujipoly America addresses this critical need with its latest materials for battery manufacturers and integrators. In this product demonstration we will introduce G1S20488 Anti-Thermal Propagation Material: This innovative material stops heat from spreading between battery cells and addresses internal changes within the cells to prevent malfunctions. We will also introduce G1S20360 Anti-Fire Propagation Material: This material helps engineers significantly reduce the risk of battery fires from starting and spreading, containing them for better safety.

It will explore what TIMs are, why they''re essential for managing heat in various applications, and what they''re made of. The conversation will delve into the different types and forms of TIMs available, the technical challenges FujiPoly tackles in this field, and whether TIMs are always necessary. Miraglia will also share key insights customers should know before using TIMs, his vision for the future of TIM technology, and how FujiPoly assists customers facing thermal management issues. Finally, the interview will touch on the long-term relevance of TIMs and whether they might become obsolete in the future.

Dispensable thermal interface materials (TIMs) play a key role in improving heat transfer between components and heat sinks by filling air gaps and creating more efficient thermal pathways. Selecting the right TIM can significantly impact thermal performance, manufacturing efficiency, and long-term product reliability.