Automating Semiconductor Packaging & Assembly

Featured Product from Palomar Technologies, Inc

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The Palomar 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the Palomar 3880’s versatility includes both eutectic and epoxy die attach, flip chip, as well as a range of options in a single machine.

This flexible bonder can include handlers on one or both sides to create an automated production line capable of higher UPH. The 3880 die bonder is ideally suited for RF GaN 5G power amplifiers, RF packages, LED assembly, microwave modules and hybrid microcircuits.