100% Bearing Free: Maglev Enables 6-DOF with Zero Contact, Applications in Hybrid Bonding, Wafer Metrology

PI (Physik Instrumente) displayed a variety of high-precision motion systems based on magnetic levitation technology, at SEMICON West 2026. This advanced technology enables active six-axis control, without any restrictions from traditional bearings. Each stage levitates and directly actuates its moving platform, eliminating mechanical bearing contact, lubrication, and bearing wear. Target applications include hybrid bonding and advanced packaging, wafer inspection, and high-resolution surface metrology.

Long-Travel Linear Stage: Force-Controlled Bonding and Inspection on the Fly
The linear demonstrator integrates 400mm of travel in X, 400µm in Y and Z, and angular motion of 1mrad in θX/θY and 2mrad in θZ in a single levitated body, with in-position stability below 2nm in Z and below 20nrad in angle. It supports a constant-velocity Z approach with contact detection, then applies process forces for bonding above 100N with mN force resolution. The stage achieves 2g acceleration and 400mm/s; other configurations support up to 6g.

Rotary Wafer Stage: Unlimited Rotation with Active Plane Control
The rotary demonstrator pairs unlimited θZ travel and speeds above 600rpm with active control of the rotor center and plane. Axial position and tip/tilt are stabilized throughout rotation, holding axial error below 5nm and tilt error below 50nrad peak-to-peak to maintain the measurement plane during wafer inspection and metrology. Payloads up to 25kg are possible with other configurations.

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