Advanced Multi-Wire Cutting for Hard & Brittle Materials

The SGSM 40 is designed for precision cutting of hard, brittle, and high-value materials, where surface integrity, dimensional accuracy, and material yield are critical.

By integrating closed-loop diamond wire technology with an adjustable swing mechanism, the system enhances cutting efficiency while maintaining superior surface quality.

Core Engineering Advantages

• Closed-Loop Endless Diamond Wire
  Continuous one-direction motion without reversing enables higher linear speed and consistent cutting stability.

• Oscillating Swing Function
  Adjustable guide wheel swing increases abrasive interaction, resulting in faster cutting and smoother surfaces.

• Multi-Wire Processing Capability
  Allows simultaneous cutting operations, significantly improving throughput and productivity.

• High-Speed Performance
  Maximum diamond wire speed up to 38 m/s, optimized for superhard material processing.

• Precision Motion Control

  • Minimum feed increment: 0.01 mm (Y/Z axis)

  • Repeat positioning accuracy: ±0.03 mm

• Configurable Swing Degree
  Swing amplitude adjustable based on material characteristics and cutting objectives.

Technical Specifications

• Max Workpiece Size: 400 × 400 × 375 mm

• Y/Z Travel: 400 mm

• Total Power Consumption: 4 kW

• Power Supply: 220V / 50Hz

• Machine Dimensions: 1200 × 950 × 2000 mm

• Machine Weight: 600 kg

Application Scope

• Semiconductor substrates

• Optical components

• Sapphire & quartz materials

• Advanced ceramics

• Composite and specialty materials

The SGSM 40 enables engineers to achieve higher yield, improved surface finish, reduced kerf loss, and stable high-precision processing across demanding material cutting applications.