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This video demonstrates Vimfun''s endless diamond wire cutting solution for ultra-large optical glass blanks up to 3 meters in diameter. The system utilizes continuous one-direction closed-loop diamond wire motion, eliminating reciprocation and reducing vibration during cutting.
The cutting process shown highlights stable machine operation, controlled wire tension, and consistent feed movement, which are critical when processing high-value and brittle optical materials. The resulting cut surface exhibits minimal wire marks, low chipping, and excellent flatness, reducing downstream grinding and polishing effort.
This solution is widely applied in aerospace and astronomical optics manufacturing, including large telescope lenses and precision optical components. Vimfun''s endless diamond wire technology is designed for large-size, high-precision, and low material-loss cutting applications where conventional wire saws struggle to maintain stability and surface quality.
This video demonstrates the SVI250-80 endless diamond wire cutting system used for machining ultra-large graphite workpieces.
The equipment is designed for processing oversized graphite blocks where conventional machining methods often face challenges such as tool wear, vibration, and inconsistent geometry. Using an endless (closed-loop) diamond wire running continuously in one direction, the system maintains stable cutting force throughout the process.
In the video, the following operations are shown:
-
Graphite block slicing for thickness-controlled
sections - External contour cutting for large-format graphite components
- Internal contour cutting for complex internal geometries
Such systems are typically selected for applications involving large graphite structures, electrodes, or components where material integrity, process stability, and repeatability are critical considerations.
This video demonstrates continuous slicing of 0.2 mm thick graphite sheets using the SV60-50 endless diamond wire cutting system.
The recording captures the full cutting process without subtitles or narration, allowing the machining behavior and machine sound to directly reflect process stability. The endless (closed-loop) diamond wire runs continuously in one direction, enabling steady material removal during thin-sheet slicing.
Key aspects shown in the video include:
- Continuous cutting of ultra-thin graphite sheets at 0.2 mm thickness
- Stable wire motion without reciprocating reversal
- Consistent slicing behavior during extended cutting cycles
- Reduced force fluctuation, supporting thin-section integrity
Such a cutting approach is typically selected for graphite applications where thin slicing accuracy, repeatability, and process controllability are critical, especially when producing fragile graphite sheets that are sensitive to vibration or load variation.
Traditional lathe grinding is slow, hard on tools, and creates excessive dust. In this video, we demonstrate how Wire cut technology can precisely and rapidly remove a 2mm oxidized layer from a graphite mold. Key Benefits of Wire cut over Grinding: Speed: Significantly faster than traditional grinding methods. Precision: Clean 2mm cut with excellent surface flatness. Cleaner Environment: wire processing reduces graphite dust. Material Recovery: The removed layer is a solid piece, not dust. Don''t forget to Like, Subscribe, and comment below if you have any questions about graphite machining!
This intuitively demonstrates how to fix the optical glass onto the device, including the required thickness of the glass base plate, the type of adhesive to use, and how to position the workpiece.
Graphite components used in semiconductor equipment often feature irregular profiles and tight dimensional requirements. During contour cutting, maintaining shape accuracy while controlling dust generation is a key process concern.
This video demonstrates the cutting of an irregular graphite part using an endless (loop-type) diamond wire cutting process. The wire runs continuously in one direction under controlled tension, avoiding frequent acceleration and reversal associated with reciprocating wire systems.
As a result, the cutting process remains stable throughout complex profile transitions, helping achieve consistent geometry and smooth contour definition. Continuous cutting motion also contributes to reduced graphite powder dispersion compared with interrupted cutting methods.
Such processes are commonly evaluated for semiconductor graphite parts where dimensional consistency, process cleanliness, and downstream assembly compatibility are critical considerations.
This video demonstrates the cutting of NdFeB (Neodymium Iron Boron) magnet material using a Vimfun endless diamond wire saw system.
NdFeB magnets are high-strength permanent magnetic materials with brittle characteristics and sensitivity to mechanical shock and localized heating. Conventional band saw or blade-based cutting methods may introduce edge chipping, surface damage, or dimensional deviation due to blade vibration and thermal effects.
The endless diamond wire mechanism operates in a continuous one-direction loop, maintaining stable tension and minimizing mechanical reversal shock. Material removal occurs through controlled abrasive grinding rather than tooth-based cutting.
In this process:
• Cutting force remains stable
• Vibration is reduced
• Edge integrity can be better controlled
• Thermal concentration is lower compared with friction-based blade systems