A simple and affordable wire cutting solution for laboratories and workshops, designed for cutting ceramics, glass, graphite, and other brittle materials with minimal chipping. (read more)

This optical glass cutting machine uses diamond wire technology to cut and slice brittle glass materials with stable motion and controlled kerf width. It is commonly used for optical glass blanks, research samples, and small batch production where edge quality and thickness consistency are important. (read more)

The SGSM 40 is a swinging diamond cutting system with adjustable oscillation, designed for fast, stable, and high-surface-quality cutting of superhard materials such as sapphire, quartz, and optical glass. (read more)

SH200-R diamond wire saw enables high-speed, high-precision cutting of brittle materials such as quartz, featuring closed-loop wire technology for improved surface quality, reduced material loss, and stable performance in industrial processing applications. (read more)

Large-size diamond wire cutting machine enables high-speed, continuous cutting of oversized hard and brittle materials, delivering improved efficiency, precision, and surface quality for industrial and advanced material processing. (read more)

The SVN 60-40 entry-level wire cutting machine provides a simple, cost-effective solution for cutting hard and brittle materials with low maintenance and easy operation. (read more)

SVI 250-80 is an ultra-large diamond wire saw designed for precision cutting of graphite, ceramics, and carbon-based materials, supporting both slicing and complex profile machining without cutting fluid. (read more)

SGI 20 CNC diamond wire contour cutting machine for glass, sapphire, and silicon, enabling precise irregular-shape cutting with smooth surfaces and stable accuracy. (read more)

Precision diamond wire cutting machine for optical glass, sapphire, and ceramics, providing stable accuracy, smooth surfaces, and efficient processing for labs and production. (read more)

Compact lab wire saw for precise cutting of fragile crystals and substrates, featuring adjustable tension, flexible positioning, and low material loss for research and sample preparation. (read more)

High-efficiency multi-wire cutting machine for wafer slicing, delivering low kerf loss, stable surface quality, and slurry-free processing for semiconductor and advanced material production. (read more)

Graphite wire saws are ideal for quickly and easily cutting graphite rods, sheets, and blocks. (read more)

A precision diamond wire saw designed for prism and multi-angle cutting of hard and brittle optical materials. The system uses a continuous loop diamond wire to achieve consistent geometry, narrow kerf loss, and reduced edge chipping. Commonly applied in optical glass, crystal, and sapphire prism fabrication where angle accuracy and surface consistency are critical. (read more)

In optical glass manufacturing, cutting efficiency is often limited by tool wear, and frequent parameter adjustments. Endless diamond wire cutting provides a continuous, one-direction motion that helps stabilize cutting forces, improve process consistency, and support higher throughput when slicing optical glass substrates and components. (read more)

Multi wire saw systems designed for high-precision slicing of hard and brittle materials including graphite, ceramics, sapphire and optical glass. Suitable for batch production and large-format cutting, offering stable tension control, programmable feed and consistent thickness performance across multiple wires. (read more)

Using closed-loop diamond wire technology and four-wire simultaneous cutting, SVM60-60 improves throughput, minimizes kerf loss, and delivers high-precision slicing for advanced materials. (read more)

SH60-R diamond wire saw enables high-efficiency and high-precision cutting of large hard and brittle materials such as quartz, glass, and sapphire, delivering smooth surfaces and stable performance in industrial processing applications. (read more)

High-accuracy contour cutting machine for silicon, glass, sapphire, quartz, and jade with efficient diamond wire technology. (read more)

Designed for semiconductor graphite cutting, this diamond wire saw uses an endless, one-way diamond wire to provide stable cutting forces and a narrow kerf. The continuous loop motion helps reduce vibration, edge chipping, and material loss, making it suitable for slicing and contour cutting of high-purity and isostatic graphite components. (read more)

High-precision diamond wire cutting machine for large graphite, ceramics, and carbon materials, featuring dual cutting systems and intelligent remote diagnostics for efficient, reliable operations. (read more)

Closed-loop diamond wire saw machines deliver fast, precise cutting for graphite, ceramics, foam cement, and other hard materials. (read more)

SGR 40 Prism Cutting Wire Saw enables fully automated multi-angle cutting of optical materials into cubes and prisms with single clamping and minimal material loss. (read more)

High-precision electroplated diamond wire loop for cutting quartz, graphite, ceramics, crystals, and advanced materials, offering durability and efficiency in dry or wet applications. (read more)

High-efficiency multi-wire cutting machine for semiconductor wafers and advanced materials, offering low kerf loss, stable surface quality, and slurry-free precision slicing. (read more)

Compact four-axis CNC diamond wire saw for precision cutting of optical glass, ceramics, and brittle materials, ideal for labs, prototyping, and small-part processing. (read more)

High-precision diamond wire cutting machine for large graphite, ceramics, and carbon materials, with dual cutting systems and intelligent remote diagnostics for efficient, reliable production. (read more)

Advanced graphite wire saw with dual cutting systems, intelligent remote diagnostics, and high-precision diamond wire cutting for slicing and complex profile machining. (read more)

Compact CNC diamond wire saw for precision cutting of glass, ceramics, and gemstones, offering contour capability, stable accuracy, and unattended operation for labs and studios. (read more)

SGSM 40 multi-wire diamond wire cutting system with adjustable oscillating swing function, engineered for high-efficiency processing of hard and brittle materials, delivering improved surface finish, reduced material loss, and stable precision control. (read more)