Cutting Superhard Materials Comes with Real Challenges
When processing sapphire, quartz, or optical glass, manufacturers often struggle with slow cutting speed, poor surface finish, high material waste, and limited cutting depth. Traditional ID saws and non-oscillating wire systems restrict productivity and make it difficult to balance precision with throughput.

SGSM 40 is engineered to solve these challenges through controlled oscillation and multi-wire cutting technology.
By combining a closed-loop diamond wire, enhanced swinging guide wheel design, and single-wire operation, SGSM 40 enables faster cutting while maintaining excellent surface quality and dimensional stability.

Key Features & Engineering Benefits

• Adjustable Swing Oscillation

  • Swing degree can be set according to material hardness and thickness

  • Improves chip removal and reduces wire wear

  • Delivers smoother cutting surfaces on brittle materials

• Closed-Loop Diamond Wire System

  • Endless wire moves in a single direction without reversing

  • Supports high linear speeds up to 58 m/s

  • Ensures stable cutting force and consistent results

• High Precision Motion Control

  • • Minimum feed increment: 0.01 mm (Y / Z axis)

    • Repeat positioning accuracy: ±0.03 mm

    • Supports precision-critical optical and semiconductor applications

• Optimized for Valuable & Brittle Materials

  • Significantly less kerf loss compared with ID saws

  • Suitable for sapphire, quartz, optical glass, ceramics, and similar materials

Designed for Engineers Who Need Efficiency, Quality, and Flexibility
SGSM 40 allows process engineers to optimize cutting parameters, reduce scrap, and improve surface finish—while production managers benefit from higher efficiency, lower consumable cost, and scalable cutting performance.