Silicon Nitride (Si?N?) Substrates

Featured Product from Xiamen Innovacera Advanced Materials Co., Ltd.

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Innovacera’s Silicon Nitride Substrates combine exceptional thermal conductivity, high mechanical strength, and excellent fracture toughness, providing outstanding reliability for high-power electronic and thermal management applications. With a thermal expansion coefficient closely matched to silicon and superior resistance to thermal shock, these substrates maintain stable performance under extreme conditions. Their precision-engineered surfaces and customizable specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules.

 

Features
  • High thermal conductivity
  • Thermal expansion coefficient close to silicon wafer
  • High strength and toughness

 

Application
  • High power IGBT power module
  • High power heat sink
  • Wireless module

 

Material Properties Table
Project Test conditions Unit Si?N?
SN-90
Material – – Si?N?
Appearance – – grey
Surface roughness Ra μm 0.2~0.75
Density – g/cm 3 ≥3.2
Physical properties Bending strength 3 -point bending resistance MPa ≥750
Vickers hardness Load 4.9 GPa ≥14
Water absorption – % 0
Thermal performance Thermal conductivity 25? W/(m·k) ≥85
Linear thermal expansion coefficient 25-500? x10 -6 mm/? 2~4
Thermal shock resistance 800? Time ≥10
Specific heat – J/(kg·K) 680
Electrical properties Dielectric constant 1MHz/25? – 7~8
Dielectric loss 1MHz/25? x10 -4 ≤4
Volume resistivity 25? Ω·cm > 10 14
Breakdown voltage – kV/mm > 15
Light performance Reflectivity Reflectivity meter – –
Whiteness Whiteness meter – –

 

Specifications and Dimensions
Material Unit Al?O? ZTA AlN Si?N?
Effective dimensions ( A , B ) mm 50.8-190 50.8-190 50.8-190 138*190
Thickness ( T ) mm 0.25-1.5 0.25-1.5 0.25-1.0 0.25 , 0.32
Thickness tolerance mm ±5% ( Min±0.03mm ) ±5% ( Min±0.03mm ) ±5% ( Min±0.03mm ) ±5% ( Min ±0.03mm )
Warpage ( C ) mm ≤0.3% ≤0.3% ≤0.3% ≤0.3%
surface roughness μm 0.2-0.6 0.2-0.5 0.2-0.75 0.2-0.75
Size, thickness and surface roughness can be customized

 

Processing

• Laser processing

 

• Grinding and polishing sheet roughness table

 

Project Qualified Special Grade
Internal dimension tolerance ±0.05mm ±0.03mm
External dimension tolerance ±0.15mm ±0.1mm
Hole tolerance (φ0.07-0.15mm) ±0.05mm ±0.02mm
Hole tolerance (φ ? 0.15mm) ±0.1mm ±0.02mm
Project Surface roughness (μm )
Qualified Special Grade
Grinding 0.3-0.6 0.3-0.5
Fine grinding 0.1-0.4 0.1-0.3
Polishing ≤0.1 ≤0.05