As 800G and 1.6T optical modules advance toward higher per channel data rates, greater integration and smaller form factors, the requirements for heat-flux density, circuit precision and high frequency interconnection around the laser chip continue to increase. High thermal conductivity aluminum nitride (AlN) ceramic combined with precision metallization shortens the heat transfer path and provides a stable packaging platform for die attachment, wire bonding, grounding and signal routing.

Product Features

- High-Thermal-Conductivity Ceramic Base
- Precision Metallized Circuits
- Suitable for High-Frequency Interconnection
- High Surface and Geometric Precision
- Reduced Thermal-Cycling Stress
- Custom Structures Available

Typical Applications

800G DR8 Optical Modules
Used as a submount for EML, Laser Diode or related laser chips in multi-channel parallel optical transmitter assemblies, combining compact circuit routing with effective thermal management.

800G FR4 Optical Modules
Custom metallized circuits and die-attach areas can be designed according to the chip, electrode layout and package architecture of four-channel wavelength-division-multiplexed transmitter assemblies.

1.6T DR8 / FR4 Optical Modules
Designed for next-generation high-bandwidth data-center interconnects, which place higher demands on heat-dissipation efficiency, circuit precision and package miniaturization.

High-Speed Data-Center Optical Transceiver Modules
Suitable for high-speed optical transmitter assemblies used in switches, servers and data-center interconnect equipment.

TOSA and Laser Packaging
Suitable for EML, DFB, edge-emitting Laser Diode, VCSEL and other customized laser chip packages.

Laser Sensing and Industrial Optoelectronic Devices

Depending on chip power, package architecture and operating environment, the application can be extended to laser sensing, industrial laser and optoelectronic devices.

Designed for 800G / 1.6T Optical Module Upgrades

In high-speed optical modules, the submount is small, but it directly affects the chip heat-transfer path, wire-bond length, grounding method and assembly accuracy. For 800G / 1.6T optical module upgrades, laser ceramic submounts must address the following changes:

- Higher channel rates and chip power concentrate more heat within each unit area;
- Continued module miniaturization requires chips, pads and traces to be arranged within a smaller space;
- High-speed signals are more sensitive to wire-bond length, grounding structure, parasitic parameters and impedance control;
- Volume packaging places higher demands on flatness, metallization consistency, bonding reliability and dimensional stability.

INNOVACERA can coordinate the design of the AlN ceramic outline, die-attach pads, wire-bonding pads, ground metallization areas and surface finishes according to the structure of EML, Laser Diode or VCSEL chips, as well as the space, thermal and electrical requirements of TOSA or optical transmitter assemblies.

Customize a Laser Ceramic Submount for Your High-Speed Optical Module

Please send us your laser chip information, submount drawings, metallization pattern and packaging requirements. INNOVACERA will assist with the evaluation of the AlN material, ceramic structure, precision metallization, machining tolerances and sample development plan.