TPS Elektronik GmbH specializes in the development of hardware and software applications for power electronics. Applications such as AC and DC power sources, charging stations, on-board chargers (OBCs), photovoltaic inverters, battery charging and discharging tests, power conversion system (PCS) storage management, etc., are part of our scope, with power levels ranging from a few hundred... Read more...
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- Improved reliability by reducing the risk of trapped air or liquids
- Tighter BGA pitches and higher density interconnects by allowing for via-in-pad instead of dog bone designs.
- Reliable filled & stacked via constructions.
- Planar copper surfaces above filled via for more reliable surface mounts & increased assembly yields.
- Enhanced....
Backdrilling is a cost-effective method to improve signal integrity without adding costly additional sub-lamination structures. This process removes the unneeded portion of a via barrel that can cause signal reflections at high speed data rates, or on high frequency RF designs. Read more...
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Whether you need 2 or 4-layer boards or have a complex HDI designs, Summits's integrated network of fabrication facilities have the experience necessary to manufacture your rigid PCB designs to exact specifications. Read more...
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Using Blind, Buried, and Stacked Vias on Complex Designs
Incorporating High Density Interconnect (HDI) structures is commonly utilized on advanced designs as a way to overcome space issues resulting from high I/O, fine pitch components. Read more...
TPS Elektronik GmbH specializes in the development of hardware and software applications for power electronics. Applications such as AC and DC power sources, charging stations, on-board chargers (OBCs), photovoltaic inverters, battery charging and discharging tests, power conversion system (PCS) storage management, etc., are part of our scope, with power levels ranging from a few hundred... Read more...
More Product Announcements from TPS Elektronik GmbH
In Jurassic World: Rebirth, chaos breaks loose when systems fail under pressure. With PCB fabrication, that’s not an option. From radar to RF to high-speed defense systems, your electronics demand reliability, precision, and durability, no matter how hostile the environment. Read more...
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From prototype runs to low-to-mid production volumes, aligning quote requests with IPC guidelines (e.g., IPC-A-610, IPC-2612, IPC-1752) helps ensure consistent communication and expectations between OEMs and contract manufacturers. Read more...
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Proper file preparation is critical for successful PCB fabrication, ensuring accuracy, efficiency, and manufacturability. Before production, manufacturers require specific design files that provide information about layers, drill holes, component placement, and routing. Read more...
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