Tronics Microsystems

Gyro MEMS Foundry: Tactical-Grade Gyroscopes Made Custom

Tronics' MAGELAN Gyro MEMS Foundry delivers high-performance gyroscope solutions tailored for aerospace and automotive systems. Read more...

More Product Announcements from Tronics Microsystems
Tronics Microsystems

Inertial MEMS Foundry: Navigation-Grade MEMS Sensors

Tronics’ MAGELAN Inertial MEMS Foundry is engineered for high-performance inertial sensors used in aerospace, automotive, and tactical applications. Read more...

More Product Announcements from Tronics Microsystems
Tronics Microsystems

Seismic MEMS Foundry: Precision Geophone Sensor Manufacturing

Tronics' MAGELAN Seismic MEMS Foundry specializes in high-performance geophone and seismic sensors. Read more...

More Product Announcements from Tronics Microsystems
Tronics Microsystems

Vibration MEMS Foundry: Smart Sensors for Predictive Maintenance

Tronics' MAGELAN Vibration MEMS Foundry empowers predictive maintenance and vibration monitoring applications with high-performance custom MEMS sensors. Read more...

More Product Announcements from Tronics Microsystems
TPS Elektronik GmbH

TPS Elektronik GmbH specializes in the development of hardware and software applications for power electronics. Applications such as AC and DC power sources, charging stations, on-board chargers (OBCs), photovoltaic inverters, battery charging and discharging tests, power conversion system (PCS) storage management, etc., are part of our scope, with power levels ranging from a few hundred... Read more...

More Product Announcements from TPS Elektronik GmbH
Summit Interconnect

  • Improved reliability by reducing the risk of trapped air or liquids
  • Tighter BGA pitches and higher density interconnects by allowing for via-in-pad instead of dog bone designs.
  • Reliable filled & stacked via constructions.
  • Planar copper surfaces above filled via for more reliable surface mounts & increased assembly yields.
  • Enhanced....
Read more...

More Product Announcements from Summit Interconnect
Summit Interconnect

Backdrilling is a cost-effective method to improve signal integrity without adding costly additional sub-lamination structures. This process removes the unneeded portion of a via barrel that can cause signal reflections at high speed data rates, or on high frequency RF designs. Read more...

More Product Announcements from Summit Interconnect
Summit Interconnect

Whether you need 2 or 4-layer boards or have a complex HDI designs, Summits's integrated network of fabrication facilities have the experience necessary to manufacture your rigid PCB designs to exact specifications. Read more...

More Product Announcements from Summit Interconnect
Summit Interconnect

Using Blind, Buried, and Stacked Vias on Complex Designs
Incorporating High Density Interconnect (HDI) structures is commonly utilized on advanced designs as a way to overcome space issues resulting from high I/O, fine pitch components. Read more...

More Product Announcements from Summit Interconnect
TPS Elektronik GmbH

TPS Elektronik GmbH specializes in the development of hardware and software applications for power electronics. Applications such as AC and DC power sources, charging stations, on-board chargers (OBCs), photovoltaic inverters, battery charging and discharging tests, power conversion system (PCS) storage management, etc., are part of our scope, with power levels ranging from a few hundred... Read more...

More Product Announcements from TPS Elektronik GmbH