Fountyl Technologies Pte. Ltd.

High-precision ceramic chuck with precision-machined ring groove patterns for wafer clamping and backside gas cooling. Available in alumina and silicon carbide. Compatible with 150-300mm wafer etch, CVD, and PVD chambers. Read more...

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Fountyl Technologies Pte. Ltd.

Porous ceramic chuck features uniform permeability, high strength, and excellent thermal resistance, ideal for semiconductor wafer grinding and precision processing applications. Read more...

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Fountyl Technologies Pte. Ltd.

High-purity SiC wafer pins and chucks for semiconductor equipment, providing plasma resistance, thermal stability, precision wafer support, and low particle generation. Read more...

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Fountyl Technologies Pte. Ltd.

Porous ceramic chucks with uniform gas permeation for non-contact wafer transport and vacuum clamping in semiconductor lithography, inspection, and metrology equipment. Read more...

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Fountyl Technologies Pte. Ltd.

Advanced porous ceramic vacuum chucks featuring sub-micron flatness and uniform airflow distribution, engineered to eliminate wafer deformation and minimize TTV during 300mm semiconductor backgrinding and inspection. Read more...

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Fountyl Technologies Pte. Ltd.

Advanced ceramic solutions provide outstanding stability, cleanliness, and durability in demanding semiconductor environments, helping improve process consistency, equipment performance, and manufacturing efficiency. Read more...

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Fountyl Technologies Pte. Ltd.

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. Read more...

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Fountyl Technologies Pte. Ltd.

Designed for next-generation manufacturing, this high-purity component delivers non-destructive wafer holding via uniform micro-pores. It ensures excellent flatness during high-vacuum processing while preventing contamination. By maintaining sub-micron coplanarity, it directly enhances production yields in lithography and inspection. Read more...

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Fountyl Technologies Pte. Ltd.

Air bearing positioning tables with zero friction, no wear, and sub-micron accuracy. Used in wafer inspection, precision metrology, and laser processing. Travel range up to 1200mm per axis, load capacity up to 100 kg. Read more...

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Fountyl Technologies Pte. Ltd.

High-precision SiC pre-aligner chucks feature excellent thermal stability and chemical resistance, making them ideal for wafer clamping, inspection, and handling applications in semiconductor manufacturing. Read more...

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