Product Announcements:
Wafer Chucks

Designed for next-generation manufacturing, this high-purity component delivers non-destructive wafer holding via uniform micro-pores. It ensures excellent flatness during high-vacuum processing while preventing contamination. By maintaining sub-micron coplanarity, it directly enhances production yields in lithography and inspection. Read more...

Air bearing positioning tables with zero friction, no wear, and sub-micron accuracy. Used in wafer inspection, precision metrology, and laser processing. Travel range up to 1200mm per axis, load capacity up to 100 kg. Read more...

High-precision SiC pre-aligner chucks feature excellent thermal stability and chemical resistance, making them ideal for wafer clamping, inspection, and handling applications in semiconductor manufacturing. Read more...

High-precision wafer pin silicon carbide chuck designed for semiconductor manufacturing, offering strong adsorption, excellent stability, and resistance to high temperature, corrosion, and wear. Ideal for wafer clamping and prealigner applications. Read more...

Microporous ceramic chuck ensures precise wafer handling with uniform adsorption, high strength, and chemical resistance. Read more...

High-precision ceramic chuck with precision-machined ring groove patterns for wafer clamping and backside gas cooling. Available in alumina and silicon carbide. Compatible with 150-300mm wafer etch, CVD, and PVD chambers. Read more...

High-purity SiC wafer pins and chucks for semiconductor equipment, providing plasma resistance, thermal stability, precision wafer support, and low particle generation. Read more...

A precision ceramic ring groove chuck designed for semiconductor wafer handling applications. It provides stable wafer support, excellent flatness, low particle generation, and reliable performance in cleanroom environments. Read more...

High-performance ceramic components, including SiC, Al₂O₃, AlN, and Si₃N₄, engineered for semiconductor equipment with superior strength, corrosion resistance, and precision processing. Read more...

This porous ceramic chuck is engineered for uniform suction and damage-free holding, providing micron-level flatness and cross-contamination prevention in high-precision semiconductor manufacturing. Read more...