Product Announcements:
Wafer Chucks

High-performance ceramic components, including SiC, Al₂O₃, AlN, and Si₃N₄, engineered for semiconductor equipment with superior strength, corrosion resistance, and precision processing. Read more...

Designed for next-generation manufacturing, this high-purity component delivers non-destructive wafer holding via uniform micro-pores. It ensures excellent flatness during high-vacuum processing while preventing contamination. By maintaining sub-micron coplanarity, it directly enhances production yields in lithography and inspection. Read more...

Microporous ceramic chuck ensures precise wafer handling with uniform adsorption, high strength, and chemical resistance. Read more...

Air floating tables eliminate friction and wear for ultra-precision positioning in wafer inspection, precision metrology, and laser processing applications. Read more...

Advanced porous ceramic vacuum chucks featuring sub-micron flatness and uniform airflow distribution, engineered to eliminate wafer deformation and minimize TTV during 300mm semiconductor backgrinding and inspection. Read more...

Advanced ceramic solutions provide outstanding stability, cleanliness, and durability in demanding semiconductor environments, helping improve process consistency, equipment performance, and manufacturing efficiency. Read more...

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. Read more...

High-precision ring groove chuck for stable wafer clamping, transfer, and processing in high-temperature and corrosive semiconductor environments. Read more...

Porous ceramic chucks with uniform gas permeation for non-contact wafer transport and vacuum clamping in semiconductor lithography, inspection, and metrology equipment. Read more...

Ring groove ceramic chuck offers high temperature, corrosion, and wear resistance for precise absorption, fixation, and transfer of silicon wafers and workpieces. Read more...