Product Announcements:
Wafer Chucks

High-purity SiC wafer pins and chucks for semiconductor equipment, providing plasma resistance, thermal stability, precision wafer support, and low particle generation. Read more...

A precision ceramic ring groove chuck designed for semiconductor wafer handling applications. It provides stable wafer support, excellent flatness, low particle generation, and reliable performance in cleanroom environments. Read more...

Porous ceramic chucks with uniform gas permeation for non-contact wafer transport and vacuum clamping in semiconductor lithography, inspection, and metrology equipment. Read more...

High-performance ceramic components, including SiC, Al₂O₃, AlN, and Si₃N₄, engineered for semiconductor equipment with superior strength, corrosion resistance, and precision processing. Read more...

Advanced porous ceramic vacuum chucks featuring sub-micron flatness and uniform airflow distribution, engineered to eliminate wafer deformation and minimize TTV during 300mm semiconductor backgrinding and inspection. Read more...

Advanced ceramic solutions provide outstanding stability, cleanliness, and durability in demanding semiconductor environments, helping improve process consistency, equipment performance, and manufacturing efficiency. Read more...

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. Read more...

This porous ceramic chuck is engineered for uniform suction and damage-free holding, providing micron-level flatness and cross-contamination prevention in high-precision semiconductor manufacturing. Read more...

Porous ceramic chuck features uniform permeability, high strength, and excellent thermal resistance, ideal for semiconductor wafer grinding and precision processing applications. Read more...

Microporous ceramic chuck ensures precise wafer handling with uniform adsorption, high strength, and chemical resistance. Read more...