Product Announcements:
Wafer Chucks

Advanced porous ceramic vacuum chucks featuring sub-micron flatness and uniform airflow distribution, engineered to eliminate wafer deformation and minimize TTV during 300mm semiconductor backgrinding and inspection. Read more...

Advanced ceramic solutions provide outstanding stability, cleanliness, and durability in demanding semiconductor environments, helping improve process consistency, equipment performance, and manufacturing efficiency. Read more...

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. Read more...

Porous ceramic chuck features uniform permeability, high strength, and excellent thermal resistance, ideal for semiconductor wafer grinding and precision processing applications. Read more...

Porous ceramic chucks with uniform gas permeation for non-contact wafer transport and vacuum clamping in semiconductor lithography, inspection, and metrology equipment. Read more...