Product Announcements:
Wafer Chucks

High-precision SiC pre-aligner chucks feature excellent thermal stability and chemical resistance, making them ideal for wafer clamping, inspection, and handling applications in semiconductor manufacturing. Read more...

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. Read more...

Air bearing positioning tables with zero friction, no wear, and sub-micron accuracy. Used in wafer inspection, precision metrology, and laser processing. Travel range up to 1200mm per axis, load capacity up to 100 kg. Read more...

High-precision wafer pin silicon carbide chuck designed for semiconductor manufacturing, offering strong adsorption, excellent stability, and resistance to high temperature, corrosion, and wear. Ideal for wafer clamping and prealigner applications. Read more...

Designed for next-generation manufacturing, this high-purity component delivers non-destructive wafer holding via uniform micro-pores. It ensures excellent flatness during high-vacuum processing while preventing contamination. By maintaining sub-micron coplanarity, it directly enhances production yields in lithography and inspection. Read more...